Liquid cooling module and manufacturing method thereof

TW202640080APending Publication Date: 2026-10-01NIDEC CHAUN-CHOUNG TECH CORP
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Patent Information

Application Number
TW114110498
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-10-01

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    Figure TWG2TA001077643_003
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Abstract

A liquid cooling module and a manufacturing method thereof are provided. The liquid cooling module includes a seat and a top plate. The seat has a plurality of cooling fins arranged in parallel. At least part of the cooling fins respectively forms a notch to together constitute a groove. The top plate is connected to the seat, covers the cooling fins, and has an inlet, an outlet, a baffle, and a rib. The baffle is parallel to the cooling fins and divides them into an inlet-fin group and an outlet-fin group. The inlet is corresponding to the inlet-fin group. The outlet is corresponding to the outlet-fin group. The rib is accommodated in the groove, abutted against the corresponding cooling fins, and perpendicular to the cooling fins and the baffle. A coolant is therefore being blocked by the rib to flow downward to improve cooling efficiency during passing the inlet-fin group.
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