Cooling device, substrate processing apparatus, and cooling method

Abstract

The cooling device of the present invention comprises: a refrigerant supply unit that supplies refrigerant at a temperature lower than the target cooling temperature of the processing liquid; a heat exchanger having a housing including a flow space through which the refrigerant supplied from the refrigerant supply unit flows, and a resin-made pipe, i.e., an inner pipe, which is disposed through the flow space with its outer surface facing the flow space and its inner space separated from the flow space, and which cools the processing liquid by heat exchange with the refrigerant; a processing liquid supply unit that supplies the processing liquid to be cooled to the inner space of the inner pipe from one end; and a pressure regulating unit that adjusts the pressure of the refrigerant inside the flow space and the pressure of the processing liquid inside the flow space. The pressure of at least one of the refrigerant and the processing liquid is adjusted such that the pressure of the processing liquid is higher than the pressure of the refrigerant between the refrigerant and the processing liquid facing each other across the pipe wall in the flow space, and the cooled processing liquid is output from the other end of the inner pipe opposite to one end.

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