Modular device with heat dissipation functionality

Abstract

A modular device with heat dissipation functionality is provided, comprising a computing module and a heat dissipation module. The computing module includes a first substrate, a processing component, and a first connecting component. The processing component is disposed on one surface of the first substrate, while the first connecting component is disposed on another surface of the first substrate. The heat dissipation module includes a thermally conductive body and a heat dissipation element. The thermally conductive body is detachably mounted on one surface of the first substrate and comprises a plurality of conducting members, an accommodating space, and a working fluid. The plurality of conducting members are spaced apart within the accommodating space and are connected to an inner wall surface of the thermally conductive body. The working fluid is contained within the accommodating space. One surface of the thermally conductive body protrudes outwardly to form a plurality of protrusions, one of which is in contact with the processing component. The heat dissipation element is detachably mounted on another surface of the thermally conductive body. Accordingly, the modular device with heat dissipation functionality provided by the present disclosure can achieve efficient and uniform heat dissipation.

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