Heat transfer devices, electronic assemblies and electronic equipment

Abstract

A heat conduction device, electronic assembly, and electronic device are disclosed. The heat conduction device is adapted to contact a functional module. The heat conduction device includes a first metal thermally conductive element, a first contact thermally conductive element, a second metal thermally conductive element, and a second contact thermally conductive element. The first contact thermally conductive element is disposed on the first metal thermally conductive element and is used to contact the functional module to conduct heat generated by the functional module to the first metal thermally conductive element. The second metal thermally conductive element is located on the side of the functional module opposite to the first metal thermally conductive element. The second contact thermally conductive element is disposed on the second metal thermally conductive element and is used to contact the functional module to conduct heat generated by the functional module to the second metal thermally conductive element.

Images