Wafer-type sensor and imaging method
TW202640100APending Publication Date: 2026-10-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114147528
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-13
- Filing Date
- 2025-12-04
- Publication Date
- 2026-10-01
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Abstract
An exemplary embodiment of the present invention provides a wafer-type sensor comprising a substrate, an imaging device, and a light source. The substrate includes a light-transmitting portion having a recess. The imaging device is disposed on the substrate. The light source is disposed in the recess of the substrate such that light is incident on the light-transmitting portion from the side of the recess, and the light transmitted inside the light-transmitting portion illuminates an object.
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