Determining device and determining method for wafers

TW202640130APending Publication Date: 2026-10-01SUMCO CORP
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Patent Information

Application Number
TW115100702
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-03
Filing Date
2026-01-08
Publication Date
2026-10-01

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Abstract

generates a defect map by superimposing the defect positions of the plurality of wafers, extracts unit sections including defects at a density equal to or greater than a density threshold from a plurality of unit sections defined in a defect map as defect-concentrated unit sections, and determines an abnormal pattern based on the distribution of the defect-concentrated unit sections.
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