Test socket and method of manufacturing the same
TW202640153APending Publication Date: 2026-10-01ISC CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115108647
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-21
- Filing Date
- 2026-03-10
- Publication Date
- 2026-10-01
Smart Images

Figure TWG2TA001079484_001 
Figure TWG2TA001079484_002 
Figure TWG2TA001079484_003
Abstract
A test socket and a method of manufacturing the same are disclosed, which are capable of effectively distributing a load applied during pressurization for testing a device under test, and preventing damage to the device under test caused by the testing thereof. The test socket according to an embodiment of the disclosure includes: a conductive part array including a plurality of conductive parts that are spaced apart from each other along a horizontal direction and are provided in a columnar shape; an insulating part array including a plurality of insulating parts that support the plurality of conductive parts and surround outer surfaces of the respective conductive parts so as to insulate the plurality of conductive parts from each other; and a support film in which film through-holes are formed to vertically penetrate the support film at positions corresponding to the plurality of terminals of the device under test. The plurality of insulating parts are spaced apart from each other in the horizontal direction so as to define a first load distribution space between the plurality of insulating parts.
Need to check novelty before this filing date? Find Prior Art
