Test socket and method of manufacturing the same

TW202640153APending Publication Date: 2026-10-01ISC CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115108647
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-21
Filing Date
2026-03-10
Publication Date
2026-10-01

Smart Images

  • Figure TWG2TA001079484_001
    Figure TWG2TA001079484_001
  • Figure TWG2TA001079484_002
    Figure TWG2TA001079484_002
  • Figure TWG2TA001079484_003
    Figure TWG2TA001079484_003
Patent Text Reader

Abstract

A test socket and a method of manufacturing the same are disclosed, which are capable of effectively distributing a load applied during pressurization for testing a device under test, and preventing damage to the device under test caused by the testing thereof. The test socket according to an embodiment of the disclosure includes: a conductive part array including a plurality of conductive parts that are spaced apart from each other along a horizontal direction and are provided in a columnar shape; an insulating part array including a plurality of insulating parts that support the plurality of conductive parts and surround outer surfaces of the respective conductive parts so as to insulate the plurality of conductive parts from each other; and a support film in which film through-holes are formed to vertically penetrate the support film at positions corresponding to the plurality of terminals of the device under test. The plurality of insulating parts are spaced apart from each other in the horizontal direction so as to define a first load distribution space between the plurality of insulating parts.
Need to check novelty before this filing date? Find Prior Art