Prober and wafer testing system

Abstract

A prober includes a prober main body configured to inspect semiconductor chips; a load port part on which a cassette accommodating plural semiconductor wafers is placed, the load port part being configured with a docking position at which semiconductor wafers can be loaded and unloaded between the cassette and the prober main body, and an undocking position which is arranged above the docking position and at which the cassette is transferred to a transport apparatus that moves along a line; and an adjustment mechanism configured to adjust the undocking position to a position at which the cassette can be transferred by the transport apparatus when the prober main body is installed at a predetermined exchange position so as to be capable of transferring a probe card to and from the transport apparatus.

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