Heat sink for semiconductor inspection

TW202640167APending Publication Date: 2026-10-01SEKISUI CHEMICAL CO LTD
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Patent Information

Application Number
TW114141264
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-25
Filing Date
2025-10-23
Publication Date
2026-10-01

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    Figure TWG2TA001078372_003
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Abstract

The present invention relates to a heat sink for semiconductor inspection, comprising: a thermally conductive layer including a polymer matrix and a thermally conductive filler, and a metal foil, wherein one or more layers of the metal foil are deposited on at least one surface of the thermally conductive layer, the thermally conductive filler comprising at least one selected from the group consisting of carbon materials, metal oxides, metal hydroxides, and metals, the thickness of the thermally conductive layer being 0.1 mm or more, the thickness of the metal foil being 0.02 mm or more, and the ratio of the area of ​​the metal foil to the area of ​​the thermally conductive layer being 1.4 or more. none
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