Optical module with photonic chip and carrier

Abstract

The present disclosure provides an optical module, which includes a substrate, a carrier, a photonic chip, and an optical transmission assembly. The substrate includes a first body having a mounting surface and a recessed space. The recessed space is recessed from the mounting surface. The carrier includes a second body and two first stepped portions. The second body has a carrying surface, and the two first stepped portions are disposed on opposite sides of the second body, respectively. The two first stepped portions abut against the mounting surface of the substrate. At least a part of the carrying surface of the second body is disposed within the recessed space. The photonic chip includes a waveguide layer and a covering layer stacked on each other. The covering layer faces and abuts against the mounting surface of the substrate. The photonic chip and the carrier are spatially separated. The optical transmission assembly is coupled to the carrying surface and optically coupled to the waveguide layer.

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