Semiconductor heating control system

Abstract

The present invention relates to a semiconductor heating control system, including a heating device, an outer channel, a flow mixing assembly and a cooling device. The heating device includes a baking body, a heat insulating cover, a plurality of heater and a controlling component. The semiconductor heating control system has a cooling channel disposed between the baking body and the heat insulating cover, and the cooling channel and the outer channel are respectively communicated with the environment. The flow mixing assembly includes a hot flow inner box, cool flow outer box, a pivot axis, a hot flow plate, a cool flow plate, a flow mixing controller and a flow mixing outlet port, wherein the hot flow inner box has a hot flow inlet port communicated with the cooling channel, the cool flow outer box has a cool flow inlet port communicated with the outer channel, and the hot flow inner box and the cool flow outer box are communicated with each other through a connecting hole. By this way, the better baking temperature uniformity of the semiconductor can be achieved through adjusting a ratio of the cool flow to the hot flow.

Description

Technical Field

[0001] This invention relates to a semiconductor heating control system, and more particularly to a semiconductor heating control system for baking wafers. Prior Technology

[0002] Baking semiconductor devices is a crucial step in the semiconductor manufacturing process. Its main purpose is to remove the solvent from the photoresist layer or coating layer on the semiconductor device, thereby enhancing the adhesion of the photoresist layer or coating layer to the surface of the semiconductor device. Among these steps, the baking temperature is particularly important, as it directly affects the electrical performance of the semiconductor device. Baking temperatures that are too high or too low can lead to damage to the semiconductor device or a decrease in its electrical performance.

[0003] Conventional semiconductor heating control systems are limited by airflow channel design and cannot effectively and accurately control temperature. As a result, they are prone to local heating temperature differences. The large temperature difference between different areas can cause uneven heating of semiconductor components, resulting in reduced baking quality and damage to the baked semiconductor components or affecting their electrical performance.

[0004] Driven by this, and in the spirit of active invention, the inventor sought a semiconductor heating control system that could solve the above problems. After several research and experiments, he finally completed this invention. Summary of the Invention

[0005] The main objective of this invention is to provide a semiconductor heating control system. By optimizing the airflow channel design and adjusting the mixing ratio of cold and hot flow, better baking temperature uniformity of semiconductor components can be achieved during baking, reducing or avoiding damage and performance impact caused by inconsistent baking temperatures, and improving the baking quality of semiconductor components.

[0006] To achieve the above objectives, the semiconductor heating control system of the present invention includes a heating device, an external channel, an airflow mixing component, and a cooling device. The heating device includes a baking oven body, a heat insulation cover, multiple heaters, and a control console. The baking oven body has an accommodating space for accommodating multiple semiconductor devices. The multiple heaters are respectively covered on the outer surface of the baking oven body. A cooling channel is provided between the baking oven body and the heat insulation cover. The cooling channel is connected to the outside through a first air inlet. The control console is electrically connected to the multiple heaters for individually controlling the temperature of multiple areas of the baking oven body to improve the temperature control effect during baking.

[0007] The external channel is connected to the outside via a second air inlet. The airflow mixing assembly includes a hot air inner chamber, a cold air outer chamber, a pivot shaft, a hot air baffle, a cold air baffle, an airflow mixing controller, and an airflow mixing exhaust port. The hot air inner chamber has a hot air inlet connected to the cooling channel, and the cold air outer chamber has a cold air inlet connected to the external channel. The hot air inner chamber and the cold air outer chamber are connected to each other via a connecting hole. The hot air baffle is housed in the hot air inner chamber and fixed on the pivot shaft, and the cold air baffle is housed in the cold air outer chamber and fixed on the pivot shaft. The pivot shaft is pivotally mounted on the hot air inner chamber and the cold air outer chamber and is controlled by the airflow mixing controller to regulate the airflow mixing ratio used for heat dissipation. The airflow mixing exhaust port connects the hot air inner chamber and the cold air outer chamber to discharge the mixed airflow. The cooling device is equipped with a blower, which is connected to the airflow mixing and exhaust port, and the airflow is discharged to the outside through the blower.

[0008] The outer surface of the baking oven can be largely covered by multiple heaters, which not only provides better heating performance, but also achieves excellent baking temperature uniformity, thereby improving the baking quality of semiconductor components and ensuring that the semiconductor components have good electrical performance after baking.

[0009] The aforementioned baking oven body may be provided with an inlet manifold assembly and an exhaust manifold assembly. The inlet manifold assembly and the exhaust manifold assembly may each include a plurality of manifolds, and each manifold may include a plurality of air holes, which are used to introduce or discharge the gas required for baking semiconductor devices.

[0010] The aforementioned semiconductor heating control system may further include a gas supply device. The baking oven body may have a plurality of openings, each of which may be connected to the gas supply device. The baking oven body may be provided with a first airtight element and a second airtight element. The plurality of openings may be disposed between the first airtight element and the second airtight element. Gas leakage inside the baking oven body is prevented by introducing gas between the two airtight elements.

[0011] The aforementioned semiconductor heating control system may further include a vacuum pump and an oxygen analyzer. The gas supply device may be connected to the inlet manifold assembly to introduce gas into the accommodating space of the baking oven body. The vacuum pump may be connected to the exhaust manifold assembly, and the oxygen analyzer may be connected to the vacuum pump to exhaust gas from the accommodating space of the baking oven body and simultaneously detect the gas.

[0012] The aforementioned semiconductor components can be wafers.

[0013] The aforementioned control console may have a loading inlet and a support frame placed on a lifting device. Semiconductor components may be placed on the support frame through the loading inlet and transported to the receiving space of the baking oven body by the lifting device.

[0014] The aforementioned support frame can be equipped with multiple temperature sensors to detect the temperature of multiple areas and adjust the output power of each heater accordingly, thereby ensuring excellent temperature uniformity during wafer baking.

[0015] The aforementioned heat insulation cover may have a filling layer sandwiched in it, which may be thermal insulation cotton.

[0016] The above overview and the following detailed description are illustrative in nature and are intended to further illustrate the scope of the invention. Other objects and advantages of the invention will be explained in the subsequent description and illustrations. Simple Explanation of the Diagram

[0017] Figure 1A is a perspective view of the semiconductor heating control system of the present invention. Figure 1B is a magnified view of the area shown by the dashed line in Figure 1A, with the outer shell removed. Figure 2 is a system architecture diagram of the semiconductor heating control system according to the first embodiment of the present invention. Figure 3 is a side view of the heating device according to the first embodiment of the present invention. Figure 4 is an exploded view of the heat insulation cover of the present invention. Figure 5 is a perspective view of the lifting device and support frame of the present invention. Figure 6 is a side view of the heating device according to the second embodiment of the present invention. Figure 7 is a perspective view of the airflow mixing component of the present invention. Figure 8 is an exploded view of the airflow mixing component of the present invention. Figure 9 is a perspective view of the baking oven body, the air intake manifold assembly, and the exhaust manifold assembly of the present invention. Figure 10 is a perspective view of the intake manifold assembly of the present invention. Figure 11 is a perspective view of the cooling device of the present invention. Figure 12 is a system architecture diagram of the gas circulation of the baking oven body of the present invention. Implementation

[0018] Please refer to Figures 1A, 1B, and 2, which are respectively a perspective view of the semiconductor heating control system of the present invention, a partial enlarged view of the dotted line area in Figure 1A with the outer casing removed, and a system architecture diagram of the semiconductor heating control system. Figure 1B is a schematic diagram after removing the outer casing 17 of the heating device 1 in Figure 1A for easier observation of its internal structure. The figures show a semiconductor heating control system 100 including a heating device 1, an external channel 2, an airflow mixing assembly 3, a cooling device 4, an air supply device 8, a vacuum pump 9 (as shown in Figure 11), and an oxygen analyzer 10 (as shown in Figure 11). The external channel 2 is disposed on the heating device 1 and communicates with the outside environment through a second air inlet 21. The airflow mixing assembly 3 is disposed on the heating device 1 and connects to both the heating device 1 and the external channel 2. A blower 41 of the cooling device 4 is connected to the airflow mixing assembly 3 through a connecting pipe 42. Furthermore, the gas supply device 8 is connected to the heating device 1, and the vacuum pump 9 and oxygen analyzer 10 are mounted on the cooling device 4 and connected to the baking oven body 11 of the heating device 1 (as shown in Figures 11 and 12). In this embodiment, the external channel 2 and the airflow mixing component 3 are mounted on the heating device 1, and the vacuum pump 9 and oxygen analyzer 10 are mounted on the cooling device 4. However, the present invention is not limited to this and can be adjusted according to the configuration of the semiconductor heating control system 100.

[0019] As shown in Figures 1B and 2, one of the cooling channels 16 of the heating device 1 is connected to the outside via a first air inlet 161. Therefore, the first cold flow C1 flows into the cooling channel 16 through the first air inlet 161, forming a hot flow H after cooling the baking oven body 11, and then flows into the airflow mixing assembly 3. On the other hand, the external channel 2 is connected to the outside via a second air inlet 21. Therefore, the second cold flow C2 flows into the external channel 2 through the second air inlet 21 and then into the airflow mixing assembly 3. The hot flow H and the second cold flow C2 are mixed inside the airflow mixing assembly 3 and then discharged to the outside via the blower 41 of the cooling device 4. The higher the speed of the blower 41, the greater the total air volume discharged, and the better the cooling effect of the baking oven body 11. Furthermore, the airflow mixing ratio of the airflow mixing component 3 (i.e., hot flow (H) air volume / second cold flow (C2) air volume) also affects the cooling effect of the heater 13 flowing outside the baking oven body 11. A higher airflow mixing ratio means that a larger proportion of air flows through the heater 13, resulting in a better cooling effect and a larger temperature difference between the hot and cold zones. Therefore, the speed of the blower 41 and the airflow mixing ratio of the airflow mixing component 3 can be adjusted according to requirements to obtain four results, as shown in Table 1.

[0020] Table 1 High blower speed low blower speed High air-fuel mixture ratio Temperature control rate: The oven body has the best cooling performance. The temperature uniformity is the worst. It has the highest energy consumption. The exhaust temperature is moderate. Temperature control rate: The oven body has moderate cooling performance. Temperature uniformity is moderate. Energy consumption is moderate. The exhaust temperature is the highest. Low air-fuel mixture ratio Temperature control rate: The oven body has moderate cooling performance. Temperature uniformity is moderate. Energy consumption is moderate. The exhaust temperature is low. Temperature control rate: The oven body has the worst cooling performance. Optimal temperature uniformity. It has the lowest energy consumption. The exhaust temperature is low.

[0021] Please refer to Figures 3 to 5, which are respectively a side view of the heating device of the first embodiment of the present invention, an exploded view of the heat insulation cover, and a perspective view of the lifting device and the support frame. As shown in the figures, the heating device 1 includes a baking oven body 11, a heat insulation cover 12, three heaters 13a, 13b, and 13c, and a control console 14. The baking oven body 11 is disposed on the control console 14 and has an accommodating space 15 therein (as shown in Figure 9). The heaters 13a, 13b, and 13c are respectively covered on the outer surface 111 of the baking oven body 11, and the heat insulation cover 12 is covered on the baking oven body 11 and the heaters 13a, 13b, and 13c. This not only provides better heating performance but also achieves excellent baking temperature uniformity, thereby improving the baking quality of the semiconductor device 5 and ensuring that the semiconductor device 5 has good electrical performance after baking. In this embodiment, the semiconductor element 5 is a wafer, and the heat shield 12 is a multilayer structure with a filling layer 121 sandwiched between it. In this embodiment, the filling layer 121 is thermal insulation cotton.

[0022] Furthermore, the control console 14 is electrically connected to heaters 13a, 13b, and 13c, and the control console 14 has a loading inlet 141 and a support frame 143 placed on a lifting device 142. A plurality of semiconductor components 5 are placed on the support frame 143 through the loading inlet 141 and transported to the receiving space 15 of the baking oven body 11 by the lifting device 142. In this embodiment, the support frame 143 is equipped with three temperature sensors 144a, 144b, and 144c to detect the temperature of multiple areas and adjust the output power of each heater accordingly, thereby ensuring excellent temperature uniformity during wafer baking. However, the invention is not limited to this; the number of temperature sensors can be adjusted as needed.

[0023] Please refer to Figure 6, which is a side view of the heating device according to the second embodiment of the present invention. As shown in the figure, the heating device 1a' of the second embodiment is similar to the heating device 1 of the first embodiment, except that the heating device 1a' of the second embodiment includes nine heaters 13a', 13b', 13c', 13d', 13e', 13f', 13g', 13h', 13i', and the outer surface 111 of the baking oven body 11 is generally covered by the heaters 13a', 13b', 13c', 13d', 13e', 13f', 13g', 13h', 13i'.

[0024] Please refer to Figures 7 and 8, which are a perspective view and an exploded view of the airflow mixing assembly, respectively. As shown in Figures 2, 7, and 8, the airflow mixing assembly 3 includes a hot flow inner chamber 31, a cold flow outer chamber 32, a pivot shaft 33, a hot flow baffle 34, a cold flow baffle 35, an airflow mixing controller 36, and an airflow mixing exhaust port 37. The hot flow inner chamber 31 has a hot flow inlet 311 communicating with the cooling channel 16, and the cold flow outer chamber 32 has a cold flow inlet 321 communicating with the external channel 2. The hot flow inner chamber 31 and the cold flow... The outer casings 32 are connected to each other by a connecting hole 38. A hot flow baffle 34 is housed within the inner hot flow casing 31 and fixed to a pivot shaft 33. A cold flow baffle 35 is housed within the outer cold flow casing 32 and fixed to a pivot shaft 33. The pivot shaft 33 is pivotally mounted on the inner hot flow casing 31 and the outer cold flow casing 32 and is controlled by an airflow mixing controller 36. An airflow mixing exhaust port 37 connects the inner hot flow casing 31 and the outer cold flow casing 32 to discharge the mixed airflow. In this embodiment, the inner hot flow casing 31 is housed within the outer cold flow casing 32, such that the outer cold flow casing 32 is partitioned by the inner hot flow casing 31 into a first outer cold flow casing space 32a and a second outer cold flow casing space 32b. However, the invention is not limited to this configuration and other arrangements are also possible.

[0025] Furthermore, the hot flow baffle 34 is perpendicular to the cold flow baffle 35, meaning that the hot flow baffle 34 and the cold flow baffle 35 are at a 90-degree angle. Therefore, when the hot flow baffle 34 is parallel to the hot flow inner chamber 31 (i.e., the airflow can flow inside the hot flow inner chamber 31), the cold flow baffle 35 is perpendicular to the cold flow outer chamber 32 (i.e., the airflow cannot flow inside the cold flow outer chamber 32). Thus, all the airflow discharged through the airflow mixing exhaust port 37 flows into the hot flow inlet 311. When the hot flow baffle 34 is perpendicular to the hot flow inner chamber 31 (i.e., the airflow cannot flow inside the hot flow inner chamber 31), the cold flow baffle 35 is parallel to the cold flow outer chamber 32 (i.e., the airflow can flow inside the cold flow outer chamber 32). Thus, all the airflow discharged through the airflow mixing exhaust port 37 flows into the cold flow inlet 321. Therefore, the angles of the hot flow baffle 34 and the cold flow baffle 35 can be controlled by rotating the pivot shaft 33, thereby adjusting the airflow mixing ratio for heat dissipation and achieving different heat dissipation effects on the heater 13 outside the baking oven body 11.

[0026] Please refer to Figures 9 and 10, which are perspective views of the baking oven body, the air inlet manifold assembly, and the exhaust manifold assembly of the present invention, respectively. As shown in Figures 1A and 9 to 10, the baking oven body 11 is provided with an air inlet manifold assembly 6 and an exhaust manifold assembly 7. The air inlet manifold assembly 6 and the exhaust manifold assembly 7 each include a plurality of manifolds 61 and 71. Each manifold 61 of the air inlet manifold assembly 6 includes a plurality of air holes 62. The exhaust manifold assembly 7 is similar to the air inlet manifold assembly 6. Although not shown in the figure, each manifold of the exhaust manifold assembly 7 also includes a plurality of air holes. The gas supply device 8 is connected to the air inlet manifold assembly 6 to introduce gas into the accommodating space 15 of the baking oven body 11 through the plurality of air holes 62, and the gas flows from the right side (air inlet side) to the left side (exhaust side) of the baking oven body 11 in the figure. Finally, the exhaust manifold assembly 7 extracts the gas out of the baking oven body 11 through the vacuum pump 9. Furthermore, the baking oven body 11 has a plurality of openings 112 and is provided with a first airtight element 113 and a second airtight element 114. The plurality of openings 112 are disposed between the first airtight element 113 and the second airtight element 114, and each opening 112 is connected to a gas supply device 8. Therefore, gas leakage inside the baking oven body 11 can be prevented by introducing gas between the two airtight elements. In this embodiment, the baking oven body 11 has two openings 112, and the gas introduced into the baking oven body 11 is nitrogen, but the present invention is not limited thereto.

[0027] Please refer to Figures 11 and 12, which are respectively a perspective view of the cooling device of the present invention and a system architecture diagram of the gas circulation of the baking oven body. As shown in Figures 1A and 7 to 11, the cooling device 4 is equipped with a blower 41, which can discharge the mixed airflow from the airflow mixing component 3 to the outside. As mentioned above, the speed of the blower 41 and the airflow mixing ratio of the airflow mixing component 3 can be adjusted according to the needs to obtain different heat dissipation and cooling results. On the other hand, regarding the gas circulation into the baking oven body 11, as shown in Figures 11 and 12, the present invention uses a gas supply device 8 to provide filling gas (usually nitrogen), and a flow meter 20 to control the gas flow rate into the baking oven body 11. After being heated by the inlet heater 30, the gas enters the accommodating space 15 through the inlet branch pipe group 6 of the baking oven body 11. After the furnace body is heated, the gas is discharged from the baking furnace body 11 through the exhaust manifold group 7, and then heated by the exhaust heater 40. After that, it is cooled by another cooling device 50 (such as the cooling device disclosed in Patent Certificate No. M603197). The cooled gas is connected to the vacuum pump 9 used to provide vacuum power during exhaust, and its oxygen content is detected by the oxygen analyzer 10. Finally, the gas is discharged to the outside.

[0028] With the above design, the semiconductor heating control system of the present invention can achieve better baking temperature uniformity of semiconductor components during baking by optimizing the airflow channel design and adjusting the airflow mixing ratio for heat dissipation. The temperature difference between each region is less than 2-4 °C, which reduces or avoids damage and performance impact caused by inconsistent baking temperatures and improves the baking quality of semiconductor components.

[0029] The above embodiments are merely examples for the purpose of illustration. The scope of the claims made in this invention should be determined by the claims of the patent application, and not limited to the above embodiments.

[0030] 1, 1a, 1a': Heating device 100: Semiconductor heating control system 11: Baking Oven Body 111: Outer surface 112: Opening 113: First airtight element 114: Second airtight element 12: Heat insulation cover 121: Fill layer 13, 13a, 13b, 13c, 13d, 13e, 13f, 13g, 13h, 13i: Heaters 13a', 13b', 13c', 13d', 13e', 13f', 13g', 13h', 13i': Heater 14: Console 141: Loading Entry 142: Lifting device 143: Support frame 144a, 144b, 144c: Temperature sensors 15: Storage space 16: Cooling Channel 161: First air intake 17: Outer shell 2: External Channel 21: Second air intake 3: Airflow mixing component 30: Intake heater 31: Heat Flow Inner Chamber 311: Hot air inlet 32: Cold flow outer box 32a: First cold flow outer casing space 32b: Second cold flow outer casing space 321: Cold air inlet 33: Pivot axis 34: Heat flow baffle 35: Cold Flow Baffle 36: Airflow Mixing Controller 37: Airflow mixing exhaust port 38: Connecting hole 4: Cooling device 40: Exhaust heater 41: Blower 42: Connecting pipe 5: Semiconductor components 50: Cooling device 6: Intake manifold assembly 61: Branch pipe 62: Stomata 7: Exhaust manifold assembly 71: Branch pipe 8: Gas supply device 9: Vacuum pump 10: Oxygen Analyzer 20: Flow meter C1: First cold flow C2: Second cold flow H: Heat flow

Claims

1. A semiconductor heating control system, comprising: a heating device including a baking oven body, a heat insulation cover, a plurality of heaters, and a control console, wherein the baking oven body has an accommodating space for accommodating a plurality of semiconductor devices, the plurality of heaters are respectively covered on the outer surface of the baking oven body, a cooling channel is provided between the baking oven body and the heat insulation cover, the cooling channel is connected to the outside via a first air inlet, and the control console is electrically connected to the plurality of heaters; and an external channel connected to the outside via a second air inlet. An airflow mixing assembly includes a hot airflow inner chamber, a cold airflow outer chamber, a pivot shaft, a hot airflow baffle, a cold airflow baffle, an airflow mixing controller, and an airflow mixing exhaust port. The hot airflow inner chamber has a hot airflow inlet communicating with a cooling channel, and the cold airflow outer chamber has a cold airflow inlet communicating with an external channel. The hot airflow inner chamber and the cold airflow outer chamber are connected to each other by a connecting hole. The hot airflow baffle is housed in the hot airflow inner chamber and fixed to the pivot shaft. On the shaft, the cold flow baffle is housed in the cold flow outer box and fixed on the pivot shaft, the hot flow baffle is perpendicular to the cold flow baffle, the pivot shaft is pivotally mounted on the hot flow inner box and the cold flow outer box and is controlled by the airflow mixing controller, the airflow mixing exhaust port is connected to the hot flow inner box and the cold flow outer box to discharge the mixed airflow; and a cooling device is provided with a blower, which is connected to the airflow mixing exhaust port and discharges the airflow to the outside through the blower.

2. The semiconductor heating control system as described in claim 1, wherein, The outer surface of the baking oven is largely covered by the plurality of heaters.

3. The semiconductor heating control system as described in claim 1, wherein, The baking oven body is provided with an air inlet manifold assembly and an exhaust manifold assembly. The air inlet manifold assembly and the exhaust manifold assembly each include a plurality of manifolds, and each manifold includes a plurality of air holes.

4. The semiconductor heating control system as described in claim 3 further includes a gas supply device, and the baking oven body has a plurality of openings, each opening being connected to the gas supply device.

5. The semiconductor heating control system as described in claim 4, wherein the baking oven body is provided with a first airtight element and a second airtight element, and the plurality of openings are disposed between the first airtight element and the second airtight element.

6. The semiconductor heating control system as described in claim 4, further comprising a vacuum pump and an oxygen analyzer, wherein the gas supply device is connected to the intake manifold assembly, the vacuum pump is connected to the exhaust manifold assembly, and the oxygen analyzer is connected to the vacuum pump.

7. The semiconductor heating control system as described in claim 1, wherein, The semiconductor device is a wafer.

8. The semiconductor heating control system as described in claim 1, wherein, The control console has a loading port and a support frame placed on a lifting device. The semiconductor device is placed on the support frame through the loading port and transported to the receiving space of the baking oven by the lifting device.

9. The semiconductor heating control system as described in claim 8, wherein, The support frame is equipped with multiple temperature sensors.

10. The semiconductor heating control system as described in claim 1, wherein, The heat insulation cover is sandwiched with a filling layer, which is thermal insulation cotton.

Images