Liquid cooled cooling device and method

Abstract

A liquid cooling and heat dissipation device and method. The superconducting element is provided with a water tank cavity， and a fresh air device is provided below the superconducting element. The water tank cavity is equipped with a refrigerant for adsorbing the temperature of the object to be dissipated， and the heat dissipation operation is completed through the superconducting element and the fresh air device. The liquid cooled heat dissipation device of the present invention also has good maintainability and scalability. Due to the structural design of the sink cavity and superconducting components， it is easy to clean and replace the refrigerant when needed， ensuring the long-term stable operation of the heat dissipation system. At the same time， the design of the device allows for modular expansion according to different heat dissipation requirements， such as adding more sink cavities or adjusting the power of the fresh air device to regulate the heat dissipation needs of higher heat loads.

Description

[Technical Field]

[0001] This invention relates to the field of liquid cooling heat dissipation technology, and specifically to a liquid cooling heat dissipation device and method. [Previous Technology]

[0002] In traditional chip heat dissipation technology, as shown in Figure 1, a heat-conducting element 2 is usually used in conjunction with a fan for heat dissipation. While this method can effectively dissipate the heat generated by the chip to a certain extent, it has some limitations that cannot be ignored. Especially under high heat load conditions, the heat dissipation capacity of the heat-conducting element may be insufficient, unable to cope with the rapidly accumulating heat in time, resulting in unsatisfactory heat dissipation effect.

[0003] In addition, relying solely on heat-conducting components for heat dissipation may cause overheating of the components themselves. This overheating will not only seriously affect the performance of the components, but may also shorten their service life and cause unnecessary economic losses.

[0004] In view of the above problems, the present invention proposes an innovative liquid cooling heat dissipation method. This method effectively reduces the temperature of objects requiring heat dissipation by utilizing the refrigerant in a loop. At the same time, it largely avoids the heat-conducting element directly bearing excessive heat load, thereby helping to extend the service life of the heat-conducting element 2 and ensuring its long-term stable operation. [Summary of the Invention]

[0005] In view of the shortcomings of the prior art, the present invention discloses a liquid cooling heat dissipation device and method to solve the above problems.

[0006] The present invention is achieved through the following technical solution:

[0007] The present invention provides a liquid cooling heat dissipation device, including a heat-conducting element, a water tank cavity provided on the heat-conducting element, and a fan device provided below the heat-conducting element. The water tank cavity is filled with a refrigerant for adsorbing the temperature of the object to be cooled, and the heat dissipation operation is completed through the heat-conducting element and the fan device.

[0008] In one embodiment, the heat-conducting element is a heat pipe or a heat-conducting plate.

[0009] In one embodiment, the water tank cavity is directly formed on the heat-conducting element and forms an integral part with the heat-conducting element.

[0010] In one embodiment, the water tank cavity is a sealed cavity formed by cutting and splicing processes.

[0011] In one embodiment, the water tank cavity is fixed to the heat-conducting element.

[0012] In one embodiment, the water tank cavity is welded to the heat-conducting element.

[0013] In one embodiment, the object to be cooled is a chip.

[0014] In one embodiment, the water tank cavity is made of aluminum alloy or stainless steel to ensure that it has good corrosion resistance and sufficient mechanical strength.

[0015] In another aspect, the present invention provides a liquid cooling heat dissipation method, comprising the following steps:

[0016] Place the object to be cooled below the heat-conducting element of the liquid cooling heat dissipation device;

[0017] Start the fan unit to promote the circulation of refrigerant;

[0018] The refrigerant absorbs heat from the object to be cooled through the heat-conducting element;

[0019] The refrigerant, after absorbing heat, flows inside the water tank cavity and transfers heat to the outside of the cavity;

[0020] The heat is carried away from the outside of the water tank cavity by the wind force of the fan device, thus completing the heat dissipation process;

[0021] The recirculating refrigerant continuously cools the object to be cooled.

[0022] In one embodiment, the method further includes a monitoring step for real-time detection of the temperature and flow rate of the refrigerant to ensure heat dissipation efficiency; when the refrigerant temperature exceeds a preset threshold, the control system automatically adjusts the fan speed to enhance the heat dissipation effect; at the same time, if the refrigerant flow rate is detected to be lower than the normal level, the system will issue an alarm and start the backup circulation pump to maintain the normal flow of the refrigerant.

[0023] The beneficial effects of the present invention are as follows:

[0024] The present invention improves heat dissipation efficiency by quickly absorbing the heat of the object to be cooled through the heat-conducting element and rapidly transferring the heat to the outside of the water tank cavity through the refrigerant circulation.

[0025] The present invention enhances the stability and reliability of the system, monitors the temperature and flow of the refrigerant in real time, and ensures the continuity and safety of the heat dissipation process.

[0026] The present invention saves energy consumption by automatically adjusting the wind speed of the fan device and optimizing energy consumption according to heat dissipation needs, thus avoiding unnecessary energy waste.

[0027] This invention improves the intelligence level of the heat dissipation system. When the refrigerant flow is abnormal, the system can issue an alarm in time and take measures to ensure the normal operation of the heat dissipation system.

Implementation Method

[0028] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] In one embodiment, referring to Figures 2 and 3, a liquid cooling heat dissipation device is provided, including a heat-conducting element 2, a water tank cavity 3 disposed on the heat-conducting element 2, and a fan device 4 disposed below the heat-conducting element 2. The water tank cavity 3 contains a refrigerant for adsorbing the temperature of the object to be cooled, and the heat dissipation operation is completed through the heat-conducting element 2 and the fan device 4. The heat-conducting element 2 is a heat-conducting pipe or a heat-conducting plate. The water tank cavity 3 is directly formed on the heat-conducting element 2 and constitutes an integral part of the heat-conducting element 2.

[0030] In one embodiment, referring to FIG4, the water tank cavity 3 is a sealed cavity formed by cutting and splicing processes. In order to ensure the stability and durability of the water tank cavity 3, the water tank cavity 3 is fixed on the heat-conducting element 2 and is tightly connected to the heat-conducting element 2 by welding.

[0031] In this embodiment, the object to be cooled is the chip 1, and the material of the water tank cavity 3 is aluminum alloy or stainless steel to ensure that it has good corrosion resistance and sufficient mechanical strength.

[0032] Referring to Figure 5, with this design, the heat required to raise the water temperature can be calculated using the following formula:

[0033] Q = mcΔT

[0034] Among them:

[0035] Q is heat, and the unit is joule (J) or calorie (cal);

[0036] m is the mass of water, measured in kilograms (kg) or grams (g);

[0037] c is the specific heat capacity of water, approximately 4.18 J / (g.°C) or 1 cal / (g.°C);

[0038] ΔT is the temperature change, and the unit is degrees Celsius (°C);

[0039] The time required for the water temperature to rise can be calculated using the following formula:

[0040]

[0041] Among them:

[0042] t is time, and the unit is seconds (s);

[0043] m is the mass of water, in kilograms (kg);

[0044] c is the specific heat capacity of water, approximately 4186 J / (kg·°C);

[0045] ΔT is the temperature change, and the unit is degrees Celsius (°C);

[0046] P is the heating power, and the unit is watts (W);

[0047] If you have 0.5 kg of water and want to raise its temperature from 25°C to 80°C using a 15-watt heater, the time required is calculated as follows:

[0048] t=0.5*4186X(80-25) / 15=7674(seconds)=128(minutes)=2.1(hours).

[0049] Therefore, based on the above formula and the given parameters, we can calculate that the time required to heat 0.5 kg of water from 25°C to 80°C is 2.1 hours. This calculation process demonstrates how to use physical formulas to solve practical problems, that is, to determine the heating time using known water quality, specific heat capacity, temperature change, and heating power.

[0050] Calculations show that the liquid cooling heat dissipation device of the present invention can effectively reduce the temperature of the chip 1, while avoiding the heat conduction element 2 from directly bearing excessive heat load, thereby extending the service life of the heat conduction element 2 and ensuring its long-term stable operation.

[0051] In one embodiment, the shape and size of the water tank cavity 3 are optimized to accommodate objects of different sizes and shapes to be cooled. For example, for a larger wafer 1, the water tank cavity 3 can be designed to be wider and deeper to provide a larger contact area and better heat dissipation. In addition, the internal structure of the water tank cavity 3 can also be designed to have multiple baffles or protrusions to increase the turbulence of the refrigerant flow, thereby improving the heat exchange efficiency.

[0052] In practical applications, the liquid cooling heat dissipation device of the present invention can be integrated into various electronic devices, such as computers, servers, and communication base stations, to provide an efficient heat dissipation solution. By using refrigerant in a loop, the device can not only effectively reduce the heat generated during equipment operation, but also reduce the noise level of the equipment to a certain extent, because traditional fan cooling methods usually generate a lot of noise.

[0053] Furthermore, the liquid cooling heat dissipation device of the present invention also has good maintainability and expandability. Due to the structural design of the water tank cavity 3 and the heat-conducting element 2, it is easy to clean and replace the refrigerant when needed, ensuring the long-term stable operation of the heat dissipation system. At the same time, the design of this device allows for modular expansion according to different heat dissipation requirements, such as adding more water tank cavities 3 or adjusting the power of the fan device 4 to adapt to higher heat load heat dissipation requirements.

[0054] The liquid cooling heat dissipation device and method of the present invention are technically innovative, can effectively solve the problems existing in traditional heat dissipation technology, improve heat dissipation efficiency, extend the service life of heat-conducting element 2, and have good intelligence and maintainability, providing an efficient, stable and environmentally friendly solution for heat dissipation of electronic devices.

[0055] The liquid cooling heat dissipation device and method of the present invention have the advantages of simple structure, high heat dissipation efficiency, good stability and high degree of intelligence, which can meet the high requirements of modern electronic equipment for heat dissipation performance and have broad application prospects.

[0056] In summary, the present invention improves heat dissipation efficiency by rapidly absorbing the heat of the object to be cooled through the heat-conducting element 2 and quickly transferring the heat to the outside of the water tank cavity 3 through the refrigerant circulation.

[0057] The present invention enhances the stability and reliability of the system, monitors the temperature and flow of the refrigerant in real time, and ensures the continuity and safety of the heat dissipation process.

[0058] The present invention saves energy consumption by automatically adjusting the wind speed of the fan device 4 and optimizing energy consumption according to heat dissipation needs, thus avoiding unnecessary energy waste.

[0059] The present invention improves the intelligence level of the heat dissipation system. When the refrigerant flow is abnormal, the system can issue an alarm in time and take measures to ensure the normal operation of the heat dissipation system.

[0060] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention. [Simplified Explanation of the Diagram]

[0061] Figure 1 is a structural diagram of a conventional heat dissipation device. Figure 2 is a first structural diagram of the water tank cavity distribution of the heat dissipation device of the present invention. Figure 3 is a second structural diagram of the water tank cavity distribution of the heat dissipation device of the present invention. Figure 4 is a third structural diagram of the water tank cavity distribution of the heat dissipation device of the present invention. Figure 5 is a comparison diagram of the heat dissipation performance of the heat dissipation device according to an embodiment of the present invention.

Claims

1. A liquid cooling heat dissipation method, comprising the following steps: The object to be cooled is placed under the heat-conducting element of the liquid cooling device; the fan is activated to promote the circulation of refrigerant; the refrigerant absorbs heat from the object through the heat-conducting element; the refrigerant, after absorbing heat, flows within the water tank cavity, transferring heat to the outside of the cavity; the fan removes the heat from the outside of the water tank cavity, completing the heat dissipation process; the refrigerant is used in a loop to continuously cool the object; the method also includes a monitoring step to detect the temperature and flow rate of the refrigerant in real time to ensure heat dissipation efficiency; when the refrigerant temperature exceeds a preset threshold, the control system automatically adjusts the fan speed to enhance the heat dissipation effect; simultaneously, if the refrigerant flow rate is detected to be lower than normal, the system will issue an alarm and activate a backup circulation pump to maintain normal refrigerant flow.

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