Circuit board for smart card, smart IC module, and smart card comprising same

TW202640433APending Publication Date: 2026-10-01LG INNOTEK CO LTD
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Patent Information

Application Number
TW114147119
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-04
Filing Date
2025-12-02
Publication Date
2026-10-01

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    Figure TWG2TA001078635_002
  • Figure TWG2TA001078635_003
    Figure TWG2TA001078635_003
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Abstract

A circuit board for a smart card according to an embodiment comprises a substrate; a metal layer disposed on the substrate; and a first cover layer disposed on the metal layer, wherein the first cover layer includes an alloy including copper, tin, and manganese.
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