Display panel

Abstract

A display panel includes a substrate, pixels disposed on the substrate, and an insulating layer disposed on the substrate. Each of the pixels includes pixel driving circuits, pad groups and light emitting elements. The pad groups are electrically connected to the pixel driving circuits respectively. The light emitting elements are respectively bonded to the pad groups. The insulating layer includes a first edge portion. The first edge portion of the insulating layer are located outside the pad groups of the pixels.

Description

Technical Field

[0001] The invention relates to a display panel. Prior Art

[0002] An LED display panel consists of an active device substrate and multiple LED elements mounted on the substrate. Inheriting the characteristics of LEDs, LED display panels offer advantages such as power saving, high efficiency, high brightness, and fast response time. Furthermore, compared to organic LED display panels, LED display panels offer advantages such as easy color adjustment, long light lifetime, and no image burn-in. Therefore, LED display panels are considered the next generation of display technology.

[0003] In the manufacturing process of LED display panels, laser bonding is used to bond multiple LED elements on a light-emitting element carrier to multiple pad groups on an active device substrate. However, there is a step between the edge of the active device substrate's film layer and the base surface of the active device substrate. During the laser bonding process, the light-emitting element carrier is squeezed along the step and softened by heat, resulting in serious misalignment between the light-emitting elements and the pad groups in the edge area. Summary of the Invention

[0004] The present invention provides a display panel with a small offset between a light emitting element and a pad group in an edge area.

[0005] A display panel according to one embodiment of the present invention includes a substrate, a plurality of pixels disposed on the substrate, and an insulating layer disposed on the substrate. Each pixel includes a plurality of pixel driving circuits, a plurality of pad groups, and a plurality of light-emitting elements. The plurality of pad groups are electrically connected to the plurality of pixel driving circuits, respectively. The plurality of light-emitting elements are respectively bonded to the plurality of pad groups. The insulating layer includes a middle portion and a first edge portion. The middle portion and the first edge portion of the insulating layer are located outside the plurality of pad groups of the plurality of pixels. The first edge portion of the insulating layer is located between the middle portion of the insulating layer and an edge of the substrate. The surface roughness of the first edge portion of the insulating layer is greater than the surface roughness of the middle portion of the insulating layer.

[0006] A display panel according to one embodiment of the present invention includes a substrate, a plurality of pixels disposed on the substrate, and an insulating layer disposed on the substrate. Each pixel includes a plurality of pixel driving circuits, a plurality of pad groups, and a plurality of light-emitting elements. The plurality of pad groups are electrically connected to the plurality of pixel driving circuits, respectively. The plurality of light-emitting elements are respectively bonded to the plurality of pad groups. The insulating layer includes a first edge portion. The first edge portion of the insulating layer is located outside the plurality of pad groups of the plurality of pixels. The first edge portion of the insulating layer has a plurality of first micro-protrusions spaced apart. The first micro-protrusions have a protrusion height ΔH1. A distance H1 is defined between the top surface of the light-emitting element and the substrate. 5% ≤ (ΔH1 / H1) ≤ 40%. Simple diagram description

[0007] FIG1 is a schematic top view of a spliced ​​display device according to an embodiment of the present invention. FIG. 2 is a top view and an enlarged schematic diagram of a display panel according to an embodiment of the present invention. FIG3 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention. FIG. 4 is a top view and an enlarged schematic diagram of a display panel according to an embodiment of the present invention. FIG5 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention. FIG6 is a schematic cross-sectional view of a display panel according to an embodiment of the present invention. FIG7 is a top view and an enlarged schematic diagram of a display panel according to another embodiment of the present invention. FIG8 is a schematic cross-sectional view of a display panel according to another embodiment of the present invention. FIG9 is a top view and an enlarged schematic diagram of a display panel according to another embodiment of the present invention. FIG10 is a schematic cross-sectional view of a display panel according to another embodiment of the present invention. Implementation Method

[0008] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Whenever possible, like reference numerals are used in the drawings and the description to refer to the same or like parts.

[0009] It should be understood that when an element, such as a layer, film, region, or substrate, is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and / or electrical connections. Furthermore, "electrically connected" or "coupled" can mean the presence of other elements between two elements.

[0010] As used herein, "about," "approximately," or "substantially" encompasses the stated value and an average value within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the particular amount of error associated with the measurement (i.e., the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, or ±5%. Furthermore, as used herein, "about," "approximately," or "substantially" may be used to select a more acceptable range of deviations or standard deviations depending on the optical property, etching property, or other property, rather than using a single standard deviation for all properties.

[0011] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present invention, and will not be interpreted as idealized or overly formal unless expressly defined as such herein.

[0012] FIG1 is a schematic top view of a tiled display device according to an embodiment of the present invention. Referring to FIG1 , the tiled display device 1 includes a plurality of display panels 10. The plurality of display panels 10 are tiled together to provide a large display image. Each display panel 10 has at least one edge 110 a that is tiled with other display panels 10.

[0013] Figure 2 is a top view and enlarged schematic diagram of a display panel according to an embodiment of the present invention. Figure 2 corresponds to the middle region R1 of a display panel 10 in Figure 1. Figure 3 is a cross-sectional schematic diagram of a display panel according to an embodiment of the present invention. Figure 3 corresponds to the section line I-I' in Figure 2. Figure 4 is a top view and enlarged schematic diagram of a display panel according to an embodiment of the present invention. Figure 4 corresponds to the edge region R2 of a display panel 10 in Figure 1. The edge region R2 has at least one edge 110a of the display panel 10. Figure 5 is a cross-sectional schematic diagram of a display panel according to an embodiment of the present invention. Figure 5 corresponds to the section line II-II' in Figure 4. Figure 6 is a cross-sectional schematic diagram of a display panel according to an embodiment of the present invention. Figure 6 corresponds to the section line III-III' in Figure 4.

[0014] 2 , 3 , 4 , 5 , and 6 , the display panel 10 includes a substrate 110 and a plurality of pixels PX disposed on the substrate 110. In some embodiments, the substrate 110 may be made of glass, quartz, an organic polymer, or an opaque / reflective material (e.g., a wafer, ceramic, or other suitable materials), or other suitable materials.

[0015] Each pixel PX includes multiple pixel driving circuits 120, multiple pad groups 130 electrically connected to the multiple pixel driving circuits 120, and multiple light-emitting elements 140 connected to the multiple pad groups 130. For example, in some embodiments, each pixel PX may optionally include three pixel driving circuits 120, three pad groups 130 electrically connected to the three pixel driving circuits 120, and three light-emitting elements 140 connected to the three pad groups 130. The three light-emitting elements 140 are configured to emit a first color, a second color, and a third color, respectively. In some embodiments, the first color, the second color, and the third color are, for example, red, green, and blue, respectively, but the present invention is not limited thereto.

[0016] In some embodiments, each pixel driving circuit 120 may optionally include a first transistor (not shown), a second transistor T, and a capacitor (not shown). The first terminal of the first transistor is electrically connected to a corresponding data line (not shown), the control terminal of the first transistor is electrically connected to a corresponding scan line (not shown), the second terminal of the first transistor is electrically connected to the control terminal Tc of the second transistor T, the first terminal Ta of the second transistor T is electrically connected to a corresponding power line (not shown), the capacitor is electrically connected to the second terminal of the first transistor and the first terminal Ta of the second transistor T, and the second terminal Tb of the second transistor T is electrically connected to a corresponding pad set 130. In short, in some embodiments, each pixel driving circuit 120 may optionally have a 2T1C architecture. However, the present invention is not limited thereto; in other embodiments, the pixel driving circuit 120 may have other architectures.

[0017] In some embodiments, each pad group 130 may optionally include a first pad 131 and a second pad 132, wherein the first pad 131 is electrically connected to a corresponding pixel driving circuit 120, and the second pad 132 is electrically connected to a corresponding common line (not shown). The two electrodes of a light-emitting element 140 are respectively bonded to the first pad 131 and the second pad 132. In some embodiments, the light-emitting element 140 may be a flip chip type and bonded to the first pad 131 and the second pad 132 of the same pad group 130. However, the present invention is not limited thereto; in other embodiments, the light-emitting element 140 may also be of other types, such as vertical or lateral.

[0018] The display panel 10 further includes an insulating layer 150 disposed on the substrate 110. In some embodiments, the insulating layer 150 is located on the pixel driving circuit 120, and the pixel driving circuit 120 is located between the insulating layer 150 and the substrate 110. The insulating layer 150 can be a single layer or a stacked structure of multiple layers. In some embodiments, the insulating layer 150 can be made of an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, or a stacked layer of at least two of these materials), an organic material, or a combination thereof.

[0019] In some embodiments, the display panel 10 further includes a molding layer 160 disposed on the insulating layer 150 and covering at least the sidewalls 140b of the light-emitting element 140. In some embodiments, the insulating layer 150 contacts the molding layer 160. In some embodiments, the display panel 10 may optionally further include a waterproof layer 170 disposed on the molding layer 160 and covering the top surface 140a of the light-emitting element 140, but the present invention is not limited thereto.

[0020] Referring to Figures 1, 2, 3, 4, and 5, the insulating layer 150 includes a middle portion 151 (shown in Figure 3) and a first edge portion 152 (shown in Figure 5). The middle portion 151 and the first edge portion 152 of the insulating layer 150 are located outside the plurality of pad groups 130 of the plurality of pixels PX. The first edge portion 152 of the insulating layer 150 is located between the middle portion 151 of the insulating layer 150 and the edge 110a of the substrate 110.

[0021] It is noteworthy that the surface roughness of the first edge portion 152 of the insulating layer 150 is greater than the surface roughness of the middle portion 151 of the insulating layer 150. When the plurality of light-emitting elements 140 on the light-emitting element carrier (not shown) are bonded to the plurality of pad assemblies 130 using a laser bonding process, although the light-emitting element carrier is heated and softened by laser irradiation, the greater surface roughness of the first edge portion 152 of the insulating layer 150 prevents the light-emitting elements 140 on the softened light-emitting element carrier from significantly shifting away from the pad assemblies 130. The problem of shifting between the light-emitting elements 140 and the pad assemblies 130, which is prone to occurring in the edge region R2, can be alleviated. When the shifting between the light-emitting elements 140 and the pad assemblies 130 is well controlled and minimized, the distance D (indicated in FIG. 4 ) between the light-emitting elements 140 and the edge 110a of the substrate 110 can be designed to be smaller, thereby reducing the width of the joint seam of the tiled display device 1.

[0022] In some embodiments, the central wavelength of the laser used in the aforementioned laser bonding process can fall within the range of 400 nm to 1200 nm, and the absorption rate of the insulating layer 150 for the laser can be less than 1%. In other words, under laser irradiation, the surface temperature of the insulating layer 150 is low, which helps mitigate the heating and softening of the light-emitting element carrier due to laser irradiation, thereby improving the misalignment between the light-emitting element 140 and the pad assembly 130. In some embodiments, the thermal conductivity of the insulating layer 150 is less than 10 W / m·K. In other words, under laser irradiation, the thermal conductivity of the insulating layer 150 is slow, which helps mitigate the heating and softening of the light-emitting element carrier due to laser irradiation, thereby improving the misalignment between the light-emitting element 140 and the pad assembly 130. In some embodiments, the wavelength of visible light falls within the range of 380 nm to 780 nm, and the transmittance of the insulating layer 150 for visible light is greater than 99%. In other words, the provision of the insulating layer 150 has little impact on the transparency of the display panel 10.

[0023] Referring to Figures 1, 2, 3, 4, and 5, in some embodiments, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-bumps 152a (shown in Figures 4 and 5) spaced apart, and the middle portion 151 of the insulating layer 150 has a flat surface 151a (shown in Figure 3). In some embodiments, the first micro-bumps 152a may be located approximately 2 mm inward from the edge 110a of the substrate 110, or 2 to 4 pixels PX inward from the edge 110a of the substrate 110, but the present invention is not limited thereto. In some embodiments, the first edge portion 152 of the insulating layer 150 having the plurality of first micro-bumps 152a is formed using a grayscale mask, for example, but the present invention is not limited thereto. The plurality of first micro-bumps 152a and the plurality of recesses between the plurality of first micro-bumps 152a may form a first concave-convex structure. In some embodiments, the first concave-convex structure may be formed by etching down an existing film layer or by adding an additional film layer.

[0024] Referring to Figures 1, 4, 5, and 6, in some embodiments, the insulating layer 150 further includes a second edge portion 153 (shown in Figure 6). The second edge portion 153 of the insulating layer 150 is located outside the plurality of pad groups 130 of the plurality of pixels PX. Referring to Figures 1, 2, 3, 4, 5, and 6, the second edge portion 153 of the insulating layer 150 is located between the middle portion 151 of the insulating layer 150 and the first edge portion 152 of the insulating layer 150. Both the first edge portion 152 and the second edge portion 153 are located in the edge region R2 of the display panel 10, and the second edge portion 153 is further away from the edge 110a of the substrate 110 than the first edge portion 152. The surface roughness of the second edge portion 153 of the insulating layer 150 is between the surface roughness of the middle portion 151 of the insulating layer 150 and the surface roughness of the first edge portion 152 of the insulating layer 150.

[0025] Referring to Figures 4, 5, and 6, in some embodiments, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-bumps 152a spaced apart, and the second edge portion 153 of the insulating layer 150 has a plurality of second micro-bumps 153a spaced apart. The protrusion height (or height difference) ΔH1 of the first micro-bumps 152a is greater than the protrusion height (or height difference) ΔH2 of the second micro-bumps 153a. In other words, in the edge region R2 of the display panel 10, the closer to the edge 110a of the substrate 110, the higher the protrusion height of the micro-bumps of the insulating layer 150, and the greater the surface roughness of the insulating layer 150. This helps further alleviate the problem of misalignment between the light-emitting element 140 and the pad assembly 130, which becomes more severe closer to the edge 110a.

[0026] The plurality of second micro-protrusions 153a and the plurality of recesses between the plurality of second micro-protrusions 153a can form a second concave-convex structure. In some embodiments, the second concave-convex structure can be formed by etching down the original film layer or by adding an additional film layer.

[0027] Referring to Figures 4 and 5 , in some embodiments, the first edge portion 152 of the insulating layer 150 has a plurality of spaced-apart first micro-protrusions 152a. Each of the first micro-protrusions 152a has a protrusion height ΔH1. A distance H1 is defined between the top surface 140a of the light-emitting element 140 and the substrate 110, and 5% ≤ (ΔH1 / H1) ≤ 40%. (ΔH1 / H1) falling within this range minimizes the impact of the first micro-protrusions 152a on other design aspects of the display panel 10. Furthermore, (ΔH1 / H1) falling within this range ensures that the molding layer 160 maintains good stability even after the waterproof layer 170 (or waterproof adhesive) is removed. Referring to Figure 5 , in this embodiment, ΔH1 is, for example, within a range of 0.15 μm to 3 μm, but the present invention is not limited thereto. Referring to Figures 4 and 6 , in some embodiments, the second edge portion 153 of the insulating layer 150 has a plurality of spaced-apart second micro-protrusions 153a. Each of the second micro-protrusions 153a has a protrusion height ΔH2. A distance H2 is defined between the top surface 140a of the light-emitting element 140 and the substrate 110, and 5% ≤ (ΔH2 / H2) ≤ 40%. (ΔH2 / H2) falling within this range minimizes the impact of the second micro-protrusions 153a on other design aspects of the display panel 10. Furthermore, (ΔH2 / H2) falling within this range ensures that the molding layer 160 maintains good stability even after the waterproof layer 170 (or waterproof adhesive) is removed.

[0028] Referring to Figures 4, 5, and 6, in some embodiments, the distribution density of the plurality of first micro-bumps 152a is greater than the distribution density of the plurality of second micro-bumps 153a. In other words, in some embodiments, in the edge region R2 of the display panel 10, the distribution density of the micro-bumps of the insulating layer 150 increases as the area closer to the edge 110a of the substrate 110 is approached. This helps further alleviate the problem of misalignment between the light-emitting element 140 and the pad assembly 130, which is more severe as the area closer to the edge 110a is approached.

[0029] It is important to note that the following embodiments share the same component numbers and some of the content as the previous embodiments. Identical or similar components are represented by the same reference numerals, and descriptions of similar technical content are omitted. For descriptions of omitted parts, please refer to the previous embodiments and will not be repeated in the following embodiments.

[0030] Figure 7 is a top view and enlarged schematic diagram of a display panel according to another embodiment of the present invention. Figure 8 is a cross-sectional schematic diagram of a display panel according to another embodiment of the present invention. Figure 8 corresponds to the section line IV-IV' of Figure 7 .

[0031] The display panel 10A shown in Figures 7 and 8 is similar to the aforementioned display panel 10, with the difference between the two being that the first edge portion 152A of the insulating layer 150 of the display panel 10A shown in Figures 7 and 8 is different from the first edge portion 152 of the insulating layer 150 of the aforementioned display panel 10. Referring to Figures 7 and 8 , in this embodiment, the first edge portion 152A of the insulating layer 150 has a plurality of first micro-protrusions 152a arranged at intervals, and the protrusion heights ΔH1 of the plurality of first micro-protrusions 152a gradually increase as they approach the edge 110a of the substrate 110.

[0032] FIG9 is a top-view and enlarged schematic diagram of a display panel according to another embodiment of the present invention. FIG10 is a cross-sectional schematic diagram of a display panel according to another embodiment of the present invention. FIG10 corresponds to section line V-V' in FIG9 . The display panel 10B shown in FIG9 and FIG10 is similar to the aforementioned display panel 10. The difference between the two is that: the aforementioned display panel 10 does not have a transmission area 110t between the multiple pixels PX, or the transmission area 110t has a very small area. As shown in FIG4 , the aforementioned display panel 10 is essentially a non-transparent display panel, and the molding layer 160 of the aforementioned display panel 10 can absorb light. However, the display panel 10B shown in FIG9 and FIG10 has sufficiently large transmission areas 110t between the multiple pixels PX, making the display panel 10B a transparent display panel, and the molding layer 160 of the display panel 10B can transmit light.

[0033] Furthermore, as shown in FIG5 , in the aforementioned display panel 10B, the insulating layer 150 and the pad assembly 130 are substantially coplanar. As shown in FIG10 , in the display panel 10B of this embodiment, the insulating layer 150 may be slightly lower than the pad assembly 130. Furthermore, referring to FIG10 , in this embodiment, the first edge portion 152 of the insulating layer 150 has a plurality of first micro-bumps 152a spaced apart from each other. The first micro-bumps 152a have a bump height ΔH1. A distance H1 is defined between the top surface 140a of the light-emitting element 140 and the substrate 110, and 5% ≤ (ΔH1 / H1) ≤ 40%. Referring to FIG10 , in this embodiment, ΔH1 is, for example, within a range of 0.5 μm to 3 μm, but the present invention is not limited thereto.

[0034] 1: Splicing display device 10, 10A, 10B: Display panel 110:Substrate 110a: Edge 110t: penetration area 120: Pixel driving circuit 130: pad group 131: First pad 132: Second pad 140: Light-emitting element 140a: Top surface 140b: Side wall 150: Insulation layer 151: Middle 151a: Flat surface 152, 152A: first edge portion 152a: first micro-protrusion 153: Second edge portion 153a: second micro-protrusion 160: Forming layer 170: Waterproof layer D, H1, H2: distance PX: pixel R1: Middle area R2: Edge area T: Second transistor Ta: The first end Tb: Second end Tc: control terminal ΔH1, ΔH2: bulge height I-I', II-II', III-III', IV-IV', V-V': hatching line

Claims

1. A display panel comprising: a substrate; A plurality of pixels are disposed on the substrate, wherein each pixel includes: a plurality of pixel driving circuits; a plurality of pad groups electrically connected to the pixel driving circuits; and a plurality of light-emitting elements bonded to the pad groups; and an insulating layer disposed on the substrate; the insulating layer includes a middle portion and a first edge portion, the middle portion and the first edge portion of the insulating layer being located outside the pad groups of the pixels, the first edge portion of the insulating layer being located between the middle portion of the insulating layer and an edge of the substrate, wherein a surface roughness of the first edge portion of the insulating layer is greater than a surface roughness of the middle portion of the insulating layer.

2. The display panel according to claim 1, wherein the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, and the middle portion of the insulating layer has a flat surface.

3. The display panel according to claim 1, wherein the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, and the protrusion heights of the first micro-protrusions gradually increase as approaching the edge of the substrate.

4. The display panel of claim 1, wherein the insulating layer further includes a second edge portion, the second edge portion of the insulating layer is located outside the pad groups of the pixels, the second edge portion of the insulating layer is located between the middle portion of the insulating layer and the first edge portion of the insulating layer, and a surface roughness of the second edge portion of the insulating layer is between the surface roughness of the middle portion of the insulating layer and the surface roughness of the first edge portion of the insulating layer.

5. A display panel as described in claim 1, wherein the insulating layer further includes a second edge portion, the second edge portion of the insulating layer is located outside the pad groups of the pixels, the second edge portion of the insulating layer is located between the middle portion of the insulating layer and the first edge portion of the insulating layer, the first edge portion of the insulating layer has a plurality of first micro-bumps arranged at intervals, the second edge portion of the insulating layer has a plurality of second micro-bumps arranged at intervals, and a protrusion height of each first micro-bump is greater than a protrusion height of each second micro-bump.

6. A display panel as described in claim 1, wherein the insulating layer further includes a second edge portion, the second edge portion of the insulating layer is located outside the pad groups of the pixels, the second edge portion of the insulating layer is located between the middle portion of the insulating layer and the first edge portion of the insulating layer, the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a distribution density of the first micro-protrusions is greater than a distribution density of the second micro-protrusions.

7. A display panel as described in claim 1, wherein the first edge portion of the insulating layer has a plurality of first micro-protrusions arranged at intervals, each of the first micro-protrusions has a protrusion height of ΔH1, a top surface of the light-emitting element has a distance from the substrate of H1, and 5%≤(ΔH1 / H1)≤40%.

8. The display panel according to claim 1, wherein a central wavelength of a laser falls within a range of 400 nm to 1200 nm, and an absorption rate of the insulating layer to the laser is less than 1%.

9. The display panel according to claim 1, wherein a wavelength of visible light falls within the range of 380 nm to 780 nm, and the transmittance of the insulating layer to the visible light is greater than 99%.

10. The display panel according to claim 1, wherein the thermal conductivity of the insulating layer is less than 10 W / m·K.

11. A display panel comprising: a substrate; A plurality of pixels are disposed on the substrate, wherein each pixel includes: a plurality of pixel driving circuits; a plurality of pad groups electrically connected to the pixel driving circuits; and a plurality of light-emitting elements bonded to the pad groups; and an insulating layer disposed on the substrate, wherein the insulating layer includes a first edge portion located outside the pad groups of the pixels, the first edge portion of the insulating layer having a plurality of first micro-bumps spaced apart, each of the first micro-bumps having a bump height ΔH1, a top surface of the light-emitting element having a distance H1 from the substrate, and 5% ≤ (ΔH1 / H1) ≤ 40%.

12. The display panel according to claim 11, wherein the protrusion heights of the first micro-protrusions gradually increase as approaching an edge of the substrate.

13. A display panel as described in claim 11, wherein the insulating layer further includes a second edge portion, the second edge portion of the insulating layer is located outside the pad groups of the pixels, the first edge portion of the insulating layer is located between the second edge portion of the insulating layer and an edge of the substrate, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a protrusion height of a first micro-protrusion is greater than a protrusion height of a second micro-protrusion.

14. A display panel as described in claim 11, wherein the insulating layer further includes a second edge portion, the second edge portion of the insulating layer is located outside the pad groups of the pixels, the first edge portion of the insulating layer is located between the second edge portion of the insulating layer and an edge of the substrate, the second edge portion of the insulating layer has a plurality of second micro-protrusions arranged at intervals, and a distribution density of the first micro-protrusions is greater than a distribution density of the second micro-protrusions.

15. The display panel according to claim 12, wherein a central wavelength of a laser falls within a range of 400 nm to 1200 nm, and an absorption rate of the insulating layer to the laser is less than 1%.

16. The display panel according to claim 11, wherein a wavelength of visible light falls within the range of 380 nm to 780 nm, and the transmittance of the insulating layer to the visible light is greater than 99%.

17. The display panel according to claim 11, wherein the thermal conductivity of the insulating layer is less than 10 W / m·K.

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