Cooling, sealing, and gas injection for efficient, extended lifetime inductively-coupled-plasma sources

TW202640701APending Publication Date: 2026-10-01LAM RES CORP
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Patent Information

Application Number
TW114145712
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-25
Filing Date
2025-11-24
Publication Date
2026-10-01

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Abstract

Inductively coupled plasma apparatus having a reaction chamber for generating an inductively coupled plasma, a liquid cooling induction coil with at least a portion helically wound around the reactor chamber, an annular heat sink encircling a flange of the reactor chamber, and a thermally conductive potting material disposed between the annular heat sink and the flange of the reactor chamber.
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