Plasma treatment unit

Abstract

The plasma processing apparatus disclosed in this invention comprises: a plasma processing chamber; a substrate support disposed within the plasma processing chamber; a dielectric window disposed above the substrate support, having an opening through the dielectric window in its central portion; a gas ejector extending through the opening of the dielectric window and mounted in the central portion of the dielectric window; an antenna disposed above the dielectric window in a manner surrounding the gas ejector; an RF power supply electrically connected to the antenna; and a heater unit mounted on the gas ejector in a manner that heats the dielectric window via the gas ejector.

Images