Atmospheric-pressure plasma processing device and efem using the same

Abstract

This invention provides an atmospheric pressure plasma processing apparatus, comprising: a plasma chamber having an inlet configured to allow a wafer to enter and exit; and a plasma reactor disposed at a top of the plasma chamber and configured to allow atmospheric pressure plasma to react with the wafer entering the plasma chamber. The wafer can be moved into and out of the plasma chamber by an atmospheric robot of a device front-end module (EFEM). The plasma reactor is configured to generate direct plasma by identifying the wafer, which enters the plasma chamber through the inlet and is the target of plasma processing, as a ground electrode. According to the invention, wafer processing residues inside the device front-end module (EFEM) can be removed via plasma.

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