Lid, device, and method of manufacturing the device

TW202640850APending Publication Date: 2026-10-01DAISHINKU CORP
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Patent Information

Application Number
TW115107360
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-21
Filing Date
2026-03-02
Publication Date
2026-10-01

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    Figure TWG2TA001079430_003
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Abstract

A cover 7 is mounted on a base 5 in a mounting area of ​​an electronic component 2. The cover 7 includes: a cover body 8 made of metal foil; a sealing material 9 disposed in at least a portion of the bonding area between the cover body 8 and the base 5, and containing a first metal with a melting point below 265°C; and a contact suppression film 31 formed on at least a portion of the mounting surface of the sealing material 9 on the base 5; wherein the contact suppression film 31 contains a second metal that does not form a solid solution with the first metal. The purpose of this disclosure is to suppress frequency variations even when sealing with a sealing material containing a low-melting-point metal.
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