MEMS microphone

TW202640914APending Publication Date: 2026-10-01LG INNOTEK CO LTD
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Patent Information

Application Number
TW114143975
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-27
Filing Date
2025-11-11
Publication Date
2026-10-01

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Abstract

According to the present embodiment, a MEMS microphone includes a first substrate; a second substrate disposed on the first substrate; an adhesive layer disposed between the first substrate and the second substrate; a PSR (Photo Solder Resist) layer disposed on the second substrate; and a MEMS structure disposed on the second substrate, in which the PSR layer includes an open region through which the second substrate is exposed, and in which the open region includes a first border part formed on an outer border of the MEMS structure.
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