Wiring circuit board

TW202640944APending Publication Date: 2026-10-01NITTO DENKO CORP
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Patent Information

Application Number
TW114148429
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-17
Filing Date
2025-12-10
Publication Date
2026-10-01

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  • Figure TWG2TA001078756_001
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    Figure TWG2TA001078756_002
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    Figure TWG2TA001078756_003
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Abstract

The wiring circuit board 1 of the present invention includes a wiring portion 3A and a support portion 2A supporting one end of the wiring portion 3A. The wiring portion 3A includes a first insulating layer 12 and wirings 133A and 133B. The width W21 of wiring 133A is greater than the width W22 of wiring 133B.
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