Circuit board and method for manufacturing the same

Abstract

A circuit board and method for manufacturing the same are provided. The circuit board includes two circuit structure substrates. Each of the two circuit structure substrates includes a glass plate, multiple conductor pillars, two redistribution layers (RDL), an insulating connection layer, and a metal pattern layer. The glass plate has an upper surface, a lower surface opposite the upper surface and a plurality of through holes. The two RDLs are placed on the upper and lower surfaces. The insulating layer is placed on one of the two RDLs. The metal pattern layer is disposed within the insulating connection layer, in which the insulating connection layers of the two circuit structure substrates are connected to each other, and the metal pattern layer of the two circuit structure substrates connected to each other. The interconnected metal pattern layers form a plurality of conductors he conductors through the insulating connection layers in the two circuit structure substrates and are connected to the two neighboring RDLs.

Images