Molded component, molded article, method for manufacturing molded component, and method for manufacturing molded article.

Abstract

Issue: To provide a molded component that allows for greater design freedom. Solution: The molded component 1 includes: a molded article 10, and a housing 80 having a housing space 81 for accommodating the molded article 10. The molded article 10 includes: a wiring layer 50 having a conductive layer 52, and a film-like substrate 30 that is deformed into a three-dimensional shape with an annular cross-sectional shape and holds the wiring layer 50 on the outside. The housing 80 has openings 82A and 82B that expose a portion 521C and 521D of the conductive layer 52.

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