Manufacturing method of substrate built into component

Abstract

The method for manufacturing a substrate embedded in a component according to the present invention includes: a cavity forming process, which forms a cavity by temporarily hardening a film containing an insulating resin and attaching it to one side of a core material; a component mounting process, which forms a component mount by fixing an electronic component onto a first conductive layer disposed on a support; a lamination process, which stacks the component mount, the cavity, the insulating layer and the second conductive layer; and a substrate forming process, which performs lamination pressing by formally hardening the film and the insulating layer.

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