Heat dissipation structure of casing and assembly method thereof

Abstract

The present invention provides a heat dissipation structure of casing and assembly method thereof, comprising: a body with an upper surface and a lower surface, wherein the upper surface and the lower surface collectively form an accommodating space, and the accommodating space includes a groove; a circuit board installed on the groove within the accommodating space, wherein the circuit board includes at least one first positioning hole, a heat source, and a heat dissipation plate, with one side of the heat source disposed on the circuit board and the other side of the heat source connected to the heat dissipation plate; and at least one positioning post, spaced apart and rotatably disposed on the lower surface, wherein the positioning posts include a mounting section and an elastic element, with the elastic element sleeved on the mounting section.

Description

[Technical Field]

[0001] The present invention relates to the structure of a housing of an electronic device, particularly a heat dissipation structure to avoid deformation during assembly, and to using this heat dissipation structure to stabilize and improve heat dissipation efficiency. [Previous Technology]

[0002] In the prior art, the housing of electronic devices is often made of aluminum extrusion housing with slide rails. Due to its soft texture and high plasticity, it is suitable for mounting circuit boards. Please refer to Figures 1A and 1B, which are side views of the prior art structure. The circuit board is pushed in horizontally and slides into the aluminum extrusion housing, so that the heat sink on the circuit board is attached to the aluminum extrusion housing to achieve the purpose of heat dissipation.

[0003] However, this assembly method often leads to the heat sink being easily damaged or deformed by friction. Furthermore, the circuit board installed inside the aluminum extrusion housing is designed with a fixed height, making it difficult to adjust the distance between the heat sink and the aluminum extrusion housing. If the distance is too short, the heat sink will collide with the housing during assembly, causing deformation or detachment. Conversely, if the distance is too long, the heat sink will not be able to contact the housing and will not be able to conduct heat, resulting in unstable heat dissipation efficiency. [Summary of the Invention]

[0004] In view of this, the present invention discloses a heat dissipation structure for a housing and its assembly method, so as to overcome the possibility of deformation during the assembly process in the prior art, as well as the problem of unstable heat dissipation of the structure.

[0005] The present invention provides a heat dissipation structure for a housing, comprising: a body having an upper surface and a lower surface, the upper surface and the lower surface together forming an accommodating space, and the accommodating space having a groove; a circuit board mounted on the groove of the accommodating space, and the circuit board having at least one first positioning hole, a heat source and a heat sink, the first positioning holes being spaced apart from each other on the circuit board, one side of the heat source being disposed on the circuit board, and the other side of the heat source being disposed on the heat sink; and at least one positioning post being spaced apart from each other and rotatably disposed on the lower surface, the positioning post having a mounting section and an elastic element, one end of the positioning post being connected to the mounting section, and the elastic element being sleeved on the mounting section.

[0006] In some embodiments, the lower surface of the body further includes at least one second positioning hole, which is disposed at intervals on the lower surface, and the positioning posts are respectively disposed in the second positioning holes.

[0007] In some embodiments, the positioning posts rotate in an operating direction and move toward the circuit board, and the mounting segment passes through the first positioning holes of the circuit board. The elastic element cannot pass through the first positioning holes and abuts against the bottom of the circuit board, thereby pushing the circuit board toward the upper surface.

[0008] In some embodiments, the groove is a strip-shaped groove.

[0009] In some embodiments, the diameter of the first positioning holes is larger than the diameter of the mounting section.

[0010] In some embodiments, the diameter of the elastic element is larger than the diameter of the first positioning holes.

[0011] The present invention provides a method for assembling a heat dissipation structure for a housing, comprising the following steps: installing positioning posts, wherein at least one positioning post is inserted through at least one second positioning hole on a lower surface of a body, such that the positioning posts are placed in an accommodating space of the body; installing a circuit board, wherein a circuit board is installed in a groove of the accommodating space; rotating the positioning posts, wherein the positioning posts rotate along an operating direction and move toward the circuit board, wherein a mounting section of the positioning posts passes through at least one first positioning hole on the circuit board, and an elastic element of the positioning posts cannot pass through the first positioning holes and abuts against the bottom of the circuit board; and lifting the positioning posts, wherein the positioning posts are continuously rotated along the operating direction, such that the circuit board moves toward an upper surface of the body, until a heat sink of the circuit board abuts against the upper surface of the body, and the rotation of the positioning posts is stopped.

[0012] In some embodiments, the diameter of the first positioning holes is larger than the diameter of the mounting section.

[0013] In some embodiments, the diameter of the elastic element is larger than the diameter of the first positioning holes.

[0014] In some embodiments, the groove is a strip-shaped groove.

[0015] The heat dissipation structure of the casing and its assembly method of the present invention can adjust the position of the circuit board in the accommodating space according to the specifications of the heat dissipation plate used, such as the compression amount and compression ratio. The elastic element generates a rebound force when it is squeezed, so that the heat dissipation plate can be completely attached to the upper surface. The elastic element can cooperate with the heat dissipation plate to change the elastic coefficient, thereby stabilizing and improving the heat dissipation efficiency, and effectively reducing the risk of structural deformation or wear during the assembly process, thereby improving the structural stability.

Implementation Method

[0016] The following describes the implementation of the present invention through specific embodiments, providing a more detailed explanation of the invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different embodiments, and various details in this specification can be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0017] Please refer to Figure 2, which is a front view of a heat dissipation structure of a housing according to the present invention.

[0018] The heat dissipation structure 1 of the casing includes a body 10, a circuit board 20 and at least one positioning post 30.

[0019] The body 10 has an upper surface 40 and a lower surface 50, which together form an accommodating space 60. The accommodating space 60 has a groove 70. The circuit board 20 is mounted on the groove 70 of the accommodating space 60. The groove 70 is a strip-shaped groove that can accommodate the circuit board 20 within the accommodating space 60. Furthermore, the circuit board 20 slides horizontally into the groove 70 of the accommodating space 60. At least one positioning post 30 is rotatably disposed on the lower surface 50, spaced apart from each other.

[0020] It should be noted that in this embodiment, as shown in FIG2, two positioning posts 30 are provided for better understanding of the structure of the present invention, rather than for limiting the technical means of the present invention.

[0021] To further illustrate the heat dissipation structure of the housing of the present invention, please refer to Figures 3A to 3C. Figure 3A is a front view of the heat dissipation structure of the housing of Figure 2, wherein the positioning post and the circuit board are not installed. Figure 3B is a front view of the heat dissipation structure of the housing of Figure 2, wherein the circuit board is not installed. Figure 3C is a front view of the heat dissipation structure of the housing of Figure 2, wherein the heat sink is not pressed against the upper surface.

[0022] The upper surface 40 and the lower surface 50 together form an accommodating space 60 for accommodating the circuit board 20. At least one first positioning hole 80 is spaced apart on the circuit board 20, and at least one second positioning hole 90 is spaced apart on the lower surface 50. The positioning post 30 passes through the second positioning hole 90 and is rotatably disposed on the lower surface 50 to control the relative position of the positioning post 30 within the accommodating space 60. The number of the first positioning hole 80, the second positioning hole 90, and the positioning post 30 should be determined according to the actual use, and the number of the first positioning hole 80 and the number of the second positioning hole 90 should be greater than or equal to the number of the positioning post 30.

[0023] It should be noted that in this embodiment, the two positioning posts 30 shown in Figures 3A to 3C are provided for better understanding of the structure of the present invention, rather than to limit the technical means of the present invention.

[0024] The circuit board 20 is mounted in a groove 70 of the accommodating space 60, and the groove 70 is a strip-shaped groove with a certain space, allowing the circuit board 20 to move vertically on the groove 70. The circuit board 20 has a heat source 100 and a heat sink 110, wherein one side of the heat source 100 is disposed on the circuit board 20, and the other side of the heat source 100 is disposed on the heat sink 110. The heat source 100 may be a central processing unit (CPU), a graphics processing unit (GPU), or other electronic components that generate heat during operation, but the present invention is not limited thereto.

[0025] The positioning post 30 has an installation section 120 and an elastic element 130. One end of the positioning post is connected to the installation section 120, and the elastic element 130 is sleeved on the installation section 120. The elastic element may be a spring, but the present invention is not limited thereto.

[0026] Rotate the positioning post 30 along the operating direction D and move the positioning post 30 toward the circuit board 20 so that the mounting section 120 of the positioning post 30 passes through the first positioning hole 80 corresponding to the circuit board 20, and the elastic element 130 cannot pass through the first positioning hole 80 and abuts against the bottom of the circuit board 20, thereby pushing the circuit board 20 toward the upper surface 40.

[0027] It should be noted that the height of the elastic element 130 can reach the bottom of the circuit board 20, and the elastic coefficient of the elastic element 130 can be adjusted to cope with the optimal compression of the heat sink 110 of different specifications, thereby improving the heat dissipation efficiency of the structure.

[0028] Wherein, the diameter of the first positioning hole 80 is greater than the diameter of the mounting section 120, and the diameter of the elastic element 130 is greater than the diameter of the first positioning hole 80.

[0029] Therefore, the heat dissipation structure 1 of the housing of the present invention can adjust the position of the circuit board 20 in the accommodating space 60 according to the specifications of the heat dissipation plate 110 used, such as the compression amount and compression ratio. The elastic element 130 generates a rebound force when it is squeezed, so that the heat dissipation plate 110 can be completely attached to the upper surface 40. The elastic element 130 can cooperate with the heat dissipation plate 110 to change the elastic coefficient, thereby stabilizing and improving the heat dissipation efficiency, and effectively reducing the risk of structural deformation or wear during assembly, thereby improving structural stability.

[0030] Please refer to Figure 4, which shows an assembly method of a heat dissipation structure for a housing according to the present invention.

[0031] A method for assembling a heat dissipation structure for a housing, comprising the following steps:

[0032] Step S10: Install positioning posts. At least one positioning post 30 is inserted through at least one second positioning hole 90 on the lower surface 50 of the body 10, so that the positioning post 30 is placed within the receiving space 60 of the body 10. The upper surface 40 and lower surface 50 of the body 10 together form the receiving space 60. The second positioning holes 90 are spaced apart on the lower surface 50. The positioning posts 30 are respectively inserted through the second positioning holes 90 and placed in the receiving space 60. The positioning posts 30 are rotatably mounted on the lower surface 50 to facilitate subsequent assembly processes.

[0033] Step S20: Install the circuit board by installing the circuit board 20 in the groove 70 of the accommodating space 60. Slide the circuit board 20 horizontally to insert it into the groove 70 in the accommodating space 60. The groove 70 is a strip groove with a certain space, allowing the circuit board 20 to move vertically in the groove 70, thereby facilitating subsequent assembly processes.

[0034] Step S30: Rotate the positioning post. The positioning post 30 rotates along the operating direction D and moves toward the circuit board 20. The mounting section 120 of the positioning post 30 passes through at least one first positioning hole 80 on the circuit board 20, and the elastic element 130 of the positioning post 30 cannot pass through the first positioning hole 80, but abuts against the bottom of the circuit board 20. Rotate the positioning post 30 along the operating direction D, and it moves toward the circuit board 20. Because the diameter of the mounting section 120 is smaller than the diameter of the first positioning hole 80, it passes through the first positioning hole 80. The mounting section 120 is fitted with the elastic element 130, and the diameter of the elastic element 130 is larger than the diameter of the first positioning hole 80, so that the elastic element 130 abuts against the bottom of the circuit board 20.

[0035] It should be noted that the height of the elastic element 130 can reach the bottom of the circuit board 20, and the elastic coefficient of the elastic element 130 can be adjusted to cope with the optimal compression of the heat sink 110 of different specifications, thereby improving the heat dissipation efficiency of the structure.

[0036] Step S40: Raise the positioning column and continuously rotate the positioning column 30 along the operating direction D, so that the circuit board 20 moves toward the upper surface 40 of the body 10 until the heat sink 110 of the circuit board 20 abuts against the upper surface 40 of the body 10, and then stop rotating the positioning column 30. Continuing from step S30, continue to rotate the positioning column 30 along the operating direction D, so that the elastic element 130 abuts against the bottom of the circuit board 20, so that the circuit board 20 moves toward the upper surface 40 of the body 10, until the heat sink 110 of the circuit board 20 abuts against the upper surface 40 of the body 10, and then stop rotating the positioning column 30.

[0037] Therefore, by adopting the heat dissipation structure of the housing and its assembly method of the present invention, the position of the circuit board 20 in the accommodating space 60 can be adjusted according to the specifications of the heat dissipation plate 110 used, such as the compression amount and compression ratio. The elastic element 130 generates a rebound force when it is squeezed, so that the heat dissipation plate 110 can be completely attached to the upper surface 40. The elastic element 130 can cooperate with the heat dissipation plate to change the elastic coefficient, thereby stabilizing and improving the heat dissipation efficiency, and effectively reducing the risk of structural deformation or wear during the assembly process, thereby improving the structural stability. [Simplified Explanation of the Diagram]

[0038] Figure 1A is a side view of a prior art structure. Figure 1B is another side view of a prior art structure. Figure 2 is a front view of a heat dissipation structure for a housing according to the present invention. Figure 3A is a front view of a heat dissipation structure for a housing according to Figure 2, wherein the positioning posts and circuit board are not installed. Figure 3B is a front view of a heat dissipation structure for a housing according to Figure 2, wherein the circuit board is not installed. Figure 3C is a front view of a heat dissipation structure for a housing according to Figure 2, wherein the heat sink is not pressed against the upper surface. Figure 4 is a flowchart of the steps of a heat dissipation structure for a housing according to the present invention. [Biomaterial Storage]

[0040] None

Claims

1. A method for assembling a heat dissipation structure for a housing, comprising the following steps: installing positioning posts, wherein at least one positioning post is inserted through at least one second positioning hole on a lower surface of a body, such that the positioning posts are placed within an accommodating space of the body; installing a circuit board, wherein a circuit board is installed in a groove of the accommodating space; rotating the positioning posts, wherein the positioning posts rotate along an operating direction and move toward the circuit board, wherein a mounting section of the positioning posts passes through at least one first positioning hole on the circuit board, and an elastic element of the positioning posts cannot pass through the first positioning holes and abuts against the bottom of the circuit board; and lifting the positioning posts, wherein the positioning posts are continuously rotated along the operating direction, such that the circuit board moves toward an upper surface of the body, until a heat sink of the circuit board abuts against the upper surface of the body, and the rotation of the positioning posts is stopped.

2. A method for assembling a heat dissipation structure for a housing as described in claim 1, wherein the diameter of the first positioning holes is larger than the diameter of the mounting section.

3. A method for assembling a heat dissipation structure for a housing as described in claim 1, wherein the diameter of the elastic element is larger than the diameter of the first positioning holes.

4. A method for assembling a heat dissipation structure for a housing as described in claim 1, wherein the groove is a strip-shaped groove.

Images