A heat dissipation system with airflow guidance

Abstract

A heat dissipation system with airflow guidance, which is used for electronic devices, comprises: a heat dissipation device housing, which is arranged in the electronic device, comprising: an upper cover, which has an air inlet, a first side wall, and an outer tooth portion, wherein the air inlet is used to suck gas into the heat dissipation device housing; a lower cover, wherein the upper cover is sleeved on the lower cover; a fan blade, wherein the fan blade is axially arranged in the accommodation space, and when the fan blade rotates, the gas is driven to form a heat dissipation airflow; a power module , which is arranged in the electronic device and includes a motor; and a transmission module, which is arranged in the electronic device and includes a screw and a main gear, wherein the main gear is sleeved on the screw and is driven to rotate by the motor and meshes with the outer gear portion to make the upper cover rotate horizontally; wherein the transmission module drives the upper cover to reciprocate between the first air outlet position and the second air outlet position respectively, thereby forming a first air outlet and a second air outlet respectively, so as to dissipate heat at different positions.

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