Heat dissipation structure and circuit board module
Patent Information
- Application Number
- TW114111638
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-27
- Publication Date
- 2026-10-01
- Estimated Expiration
- 2045-03-26
AI Technical Summary
Existing electronic devices using liquid metal for heat dissipation face issues with leakage causing short circuits on substrates or circuit boards when tilted or vibrated, affecting heat dissipation performance.
A heat dissipation structure comprising a first leak-proof layer, a second leak-proof layer, a thermally conductive material, and a heat sink, which separates the conductive material from electronic components, reducing leakage risks and enhancing heat conduction.
The structure effectively prevents short circuits while maintaining good heat dissipation by containing the thermally conductive material, ensuring mechanical stability and durability across varying contact surfaces.
Smart Images
Figure TWG2TA001077902_001 
Figure TWG2TA001077902_002 
Figure TWG2TA001077902_003
Abstract
Description
[Technical Field]
[0001] The present invention relates to a heat dissipation structure and a circuit board module, and more particularly to a heat dissipation structure disposed on a circuit board and a circuit board module having the above-mentioned heat dissipation structure. [Previous Technology]
[0002] As the efficiency of electronic devices continues to improve, some commercially available electronic devices currently use liquid metal for heat dissipation. However, when electronic devices are tilted or vibrated, liquid metal may leak onto the substrate or circuit board, causing short circuits and affecting heat dissipation performance. Therefore, how to enable electronic devices to have good heat dissipation while avoiding short circuits on the substrate or circuit board is a problem that the art is dedicated to exploring. [Summary of the Invention]
[0003] The present invention provides a heat dissipation structure, which has a good heat dissipation effect and can avoid short circuits in the substrate or circuit board.
[0004] The present invention provides a circuit board module having the above-mentioned heat dissipation structure.
[0005] A heat dissipation structure of the present invention is suitable for dissipating heat from a heat source on a substrate of a circuit board. The heat dissipation structure is disposed on the circuit board and includes a first leak-proof layer, a second leak-proof layer, a thermally conductive material, and a heat sink. The first leak-proof layer is coupled to the substrate and has a first opening, with the heat source located within the first opening. The second leak-proof layer is coupled to the circuit board and has a second opening, wherein the first leak-proof layer and the substrate are located within the second opening. The thermally conductive material is located within the first opening and in contact with the heat source. The heat sink covers the first opening and the second opening and is connected to the first leak-proof layer and the second leak-proof layer. The heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board through the first leak-proof layer and the second leak-proof layer.
[0006] A circuit board module of the present invention includes a circuit board, a processor, and a heat dissipation structure. The processor is disposed on the circuit board and includes a substrate and a heat source, the heat source being disposed on the substrate. The heat dissipation structure is disposed on the circuit board, in contact with the processor, and includes a first leak-proof layer, a second leak-proof layer, a thermally conductive material, and a heat sink. The first leak-proof layer is coupled to the substrate and has a first opening, the heat source being located within the first opening. The second leak-proof layer is coupled to the circuit board and has a second opening, wherein the first leak-proof layer and the substrate are located within the second opening. The thermally conductive material is located within the first opening and in contact with the heat source. The heat sink covers the first opening and the second opening and is connected to the first leak-proof layer and the second leak-proof layer, wherein the heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board by means of the first leak-proof layer and the second leak-proof layer.
[0007] In one embodiment of the present invention, the above-mentioned heat dissipation structure further includes an insulating layer, the insulating layer being located between the substrate and the first leak-proof layer, the insulating layer having a third opening, the third opening corresponding to the first opening, and the heat source and the heat-conducting material being located within the third opening.
[0008] In one embodiment of the present invention, the above-mentioned insulating layer covers at least one second electronic component on the substrate.
[0009] In one embodiment of the present invention, the above-mentioned heat dissipation structure further includes a coating layer, which is located between the circuit board and the second leak-proof layer and covers at least one first electronic component on the circuit board.
[0010] In one embodiment of the present invention, the second leak-proof layer is composed of a thermally conductive gel, and the heat of at least one first electronic component is adapted to be conducted to the heat sink through the second leak-proof layer.
[0011] In one embodiment of the present invention, the first leak-proof layer is composed of another thermally conductive gel, and the conductivity coefficient of the other thermally conductive gel of the first leak-proof layer is less than the conductivity coefficient of the thermally conductive gel of the second leak-proof layer.
[0012] Based on the above, the heat dissipation structure of the circuit board module of the present invention includes a first leak-proof layer surrounding the thermally conductive material and a second leak-proof layer surrounding the first leak-proof layer and the substrate. Accordingly, the first leak-proof layer can reduce the probability of the thermally conductive material leaking to the substrate, and the second leak-proof layer can further reduce the probability of the thermally conductive material leaking to the circuit board, thereby reducing the probability of short circuits in the substrate or circuit board. In addition, since the thermally conductive material of the present invention is located between the heat sink and the heat source, the heat from the heat source can be conducted to the heat sink through the thermally conductive material, thus achieving a good heat dissipation effect.
Implementation Method
[0013] FIG1 is a schematic diagram of a circuit board module according to an embodiment of the present invention. FIG2 is an exploded view of the circuit board module of FIG1. FIG3 is a partial cross-sectional view of the circuit board module of FIG1. Referring to FIG1 to FIG3, the circuit board module 100 (e.g., a graphics card) of this embodiment includes a processor 110, a heat dissipation structure 120, and a circuit board 130. The processor 110 is disposed on the circuit board 130 and includes a substrate 111 and a heat source 113, the heat source 113 being disposed on the substrate 111. The heat dissipation structure 120 is disposed on the circuit board 130 and contacts the processor 110 to dissipate heat from the heat source 113. In this embodiment, the heat source 113 is, for example, a die of a graphics processing unit (GPU) or a central processing unit (CPU), but is not limited thereto.
[0014] Referring to Figures 2 and 3, in detail, the heat dissipation structure 120 includes a first leak-proof layer 121, a second leak-proof layer 122, a thermally conductive material 123, and a heat sink 124. The first leak-proof layer 121 is coupled to the substrate 111 and has a first opening 1211. The heat source 113 is located within the first opening 1211. The second leak-proof layer 122 is coupled to the circuit board 130 and has a second opening 1221. The first leak-proof layer 121 and the substrate 111 are located within the second opening 1221. The thermally conductive material 123 is located within the first opening 1211 and contacts the heat source 113. The heat sink 124 covers the first opening 1211 and the second opening 1221 and is connected to the first leak-proof layer 121 and the second leak-proof layer 122. The heat dissipation structure 120 separates the thermally conductive material 123 from at least one first electronic component 131 (shown as two) on the circuit board 130 by means of a first leak-proof layer 121 and a second leak-proof layer 122.
[0015] In this embodiment, the first electronic component 131 is, for example, a metal-oxide-semiconductor field-effect transistor (MOSFET) or a video random access memory (VRAM). The thermal conductive material 123 is, for example, thermal paste, liquid metal, composite metal thermal paste, or other thermal conductive materials that may be in liquid form. However, the types of the first electronic component 131 and the thermal conductive material 123 are not limited to those described above.
[0016] It is worth mentioning that, in this embodiment, the heat dissipation structure 120 of the circuit board module 100 uses a first leak-proof layer 121 to surround the thermally conductive material 123 to reduce the probability of the thermally conductive material 123 leaking to the substrate 111, and uses a second leak-proof layer 122 to surround the substrate 111 to further reduce the probability of the thermally conductive material 123 leaking to the circuit board 130, thereby reducing the probability of short circuits in the substrate 111 or the circuit board 130. In addition, in this embodiment, the circuit board module 100 uses the heat dissipation structure 120 to contact the heat source 113, so that the heat from the heat source 113 is conducted to the heat sink 124 through the thermally conductive material 123, thereby giving the heat source 113 a good heat dissipation effect.
[0017] In this embodiment, the first leak-proof layer 121 is composed of, for example, 3 watts of thermally conductive gel, and the second leak-proof layer 122 is composed of, for example, 6 watts of thermally conductive gel. Accordingly, the heat from the heat source 113 on the substrate 111 is adapted to be conducted to the heat sink 124 through the first leak-proof layer 121, and the heat from the first electronic component 131 on the circuit board 130 is adapted to be conducted to the heat sink 124 through the second leak-proof layer 122, so that both the heat source 113 and the first electronic component 131 have good heat dissipation effects.
[0018] Furthermore, since the thermally conductive gel constituting the first leak-proof layer 121 and the second leak-proof layer 122 has flexibility and compressibility, the heat dissipation structure 120 can adapt to contact surfaces of different shapes and sizes, thereby enabling the heat dissipation structure 120 to have good mechanical stability and durability. In other embodiments, the first leak-proof layer 121 may also be made of a material with a mesh structure (e.g., foam, sponge), which can absorb the thermally conductive material 123, thereby improving the leak-proof effect.
[0019] In this embodiment, the conductivity of the thermally conductive gel of the first leak-proof layer 121 (e.g., a 3-watt thermally conductive gel) is less than that of the thermally conductive gel of the second leak-proof layer 122 (e.g., a 6-watt thermally conductive gel), thereby preventing the first leak-proof layer 121 from reacting chemically with the thermally conductive material 123.
[0020] FIG4 is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Referring to FIG4, the difference between the heat dissipation structure 120a of the circuit board module 100a in this embodiment and the heat dissipation structure 120 of the circuit board module 100 described above is that the heat dissipation structure 120a in this embodiment further includes an insulating layer 125, which is located between the substrate 111 and the first leak-proof layer 121. The insulating layer 125 has a third opening 1251, which corresponds to the first opening 1211, and the heat source 113 and the heat-conducting material 123 are located within the third opening 1251. The insulating layer 125 covers at least one second electronic component 1111 (e.g., a capacitor, and two are shown) on the substrate 111. Accordingly, the circuit board module 100a of this embodiment can prevent the leaked heat-conducting material 123 from causing a short circuit in the substrate 111 by means of the insulating layer 125. In this embodiment, the insulating layer 125 is made of, for example, an insulating pad or an ultraviolet-curable adhesive (UV adhesive), but is not limited thereto.
[0021] The remaining configurations and modes of operation of the heat dissipation structure 120a in this embodiment are the same as or similar to those of the heat dissipation structure 120 in the embodiments shown in Figures 1 to 3, and will not be described again here.
[0022] FIG5 is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Referring to FIG5, the difference between the heat dissipation structure 120b of the circuit board module 100b in this embodiment and the heat dissipation structure 120 of the circuit board module 100 in the above embodiment is that the heat dissipation structure 120b in this embodiment further includes a coating layer 126, which is located between the circuit board 130 and the second anti-leakage layer 122 and covers at least one first electronic component 131 on the circuit board 130. Accordingly, the circuit board module 100b of this embodiment can provide corrosion protection, moisture protection and short circuit protection for the circuit board 130 by means of the coating layer 126 disposed on the circuit board 130. In this embodiment, the coating layer 126 is, for example, made of conformal coating, but is not limited thereto.
[0023] The remaining configurations and modes of operation of the heat dissipation structure 120b in this embodiment are the same as or similar to those of the heat dissipation structure 120 in the embodiments shown in Figures 1 to 3, and will not be described again here.
[0024] FIG6 is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. Referring to FIG6, the difference between the heat dissipation structure 120c of the circuit board module 100c in this embodiment and the heat dissipation structure 120b of the circuit board module 100b in the above embodiment is that the heat dissipation structure 120c in this embodiment has the insulating layer 125 shown in FIG4 above, which, together with the coating layer 126, can prevent the leaked thermal conductive material 123 from causing a short circuit in the substrate 111 or the circuit board 130.
[0025] The remaining configurations and modes of operation of the heat dissipation structure 120c in this embodiment are the same as or similar to those of the heat dissipation structure 120b in the embodiment shown in FIG5, and will not be described again here.
[0026] FIG7 is a schematic diagram of the heat sink and the second leak-proof layer according to another embodiment of the present invention from another perspective. Referring to FIG7, since the second leak-proof layer 122 of this embodiment is composed of a flexible and compressible thermally conductive gel as described above, the user can make the second leak-proof layer 122 have different shapes according to the design of the circuit board 130, and the user can also add thermally conductive gel to other locations where enhanced protection is required. In addition, during assembly, the assembler can first automatically apply the second leak-proof layer 122 to the heat sink 124, and then assemble the heat sink 124 and the second leak-proof layer 122 together with the other components of the heat dissipation structure 120, the processor 110 and the circuit board 130, thereby achieving better assembly efficiency.
[0027] In summary, the heat dissipation structure of the circuit board module of the present invention includes a first leak-proof layer surrounding the thermally conductive material and a second leak-proof layer surrounding the first leak-proof layer and the substrate. Accordingly, the first leak-proof layer can reduce the probability of the thermally conductive material leaking to the substrate, and the second leak-proof layer can further reduce the probability of the thermally conductive material leaking to the circuit board, thereby reducing the probability of short circuits in the substrate or circuit board. In addition, since the thermally conductive material of the present invention is located between the heat sink and the heat source, the heat from the heat source can be conducted to the heat sink through the thermally conductive material, thus achieving a good heat dissipation effect. [Simplified Explanation of the Diagram]
[0028] FIG1 is a schematic diagram of a circuit board module according to an embodiment of the present invention. FIG2 is an exploded view of the circuit board module of FIG1. FIG3 is a partial cross-sectional view of the circuit board module of FIG1. FIG4 is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. FIG5 is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. FIG6 is a partial cross-sectional schematic diagram of a circuit board module according to another embodiment of the present invention. FIG7 is a schematic diagram of a heat sink and a second leak-proof layer according to another embodiment of the present invention from another perspective.
Claims
1. A heat dissipation structure suitable for dissipating heat from a heat source on a substrate of a circuit board, the heat dissipation structure being disposed on the circuit board and comprising: A first leak-proof layer is coupled to the substrate and has a first opening, the heat source being located inside the first opening; A second leak-proof layer coupled to the circuit board and having a second opening, wherein the first leak-proof layer and the substrate are located within the second opening; a thermally conductive material located within the first opening and in contact with the heat source; and a heat sink covering the first opening and the second opening and connected to the first leak-proof layer and the second leak-proof layer, wherein the heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board by means of the first leak-proof layer and the second leak-proof layer.
2. The heat dissipation structure as claimed in claim 1 further includes an insulating layer, wherein the insulating layer is located between the substrate and the first leak-proof layer, the insulating layer having a third opening corresponding to the first opening and the heat source and the thermally conductive material being located within the third opening.
3. The heat dissipation structure as described in claim 2, wherein the insulating layer covers at least one second electronic component on the substrate.
4. The heat dissipation structure as claimed in claim 1 further includes a coating layer, wherein the coating layer is located between the circuit board and the second leak-proof layer and covers the at least one first electronic component on the circuit board.
5. The heat dissipation structure as claimed in claim 1, wherein the second leak-proof layer is composed of a thermally conductive gel, and the heat of the at least one first electronic component is adapted to be conducted to the heat sink via the second leak-proof layer.
6. The heat dissipation structure as claimed in claim 5, wherein the first leak-proof layer is composed of another thermally conductive gel, the conductivity of the other thermally conductive gel of the first leak-proof layer being less than the conductivity of the thermally conductive gel of the second leak-proof layer.
7. A circuit board module, comprising: A circuit board; a processor disposed on the circuit board and including a substrate and a heat source disposed on the substrate; And a heat dissipation structure disposed on the circuit board, in contact with the processor, and including: a first leak-proof layer coupled to the substrate and having a first opening, wherein the heat source is located in the first opening; A second leak-proof layer coupled to the circuit board and having a second opening, wherein the first leak-proof layer and the substrate are located within the second opening; a thermally conductive material located within the first opening and in contact with the heat source; and a heat sink covering the first opening and the second opening and connected to the first leak-proof layer and the second leak-proof layer, wherein the heat dissipation structure separates the thermally conductive material from at least one first electronic component on the circuit board by means of the first leak-proof layer and the second leak-proof layer.
8. The circuit board module as claimed in claim 7, wherein the heat dissipation structure further includes an insulating layer located between the substrate and the first leak-proof layer, the insulating layer having a third opening corresponding to the first opening and the heat source and the thermally conductive material located within the third opening.
9. The circuit board module as claimed in claim 8, wherein the insulating layer covers at least one second electronic component on the substrate.
10. The circuit board module of claim 7, wherein the heat dissipation structure further includes a coating layer located between the circuit board and the second leak-proof layer and covering the at least one first electronic component on the circuit board.
11. The circuit board module of claim 7, wherein the second leak-proof layer is composed of a thermally conductive gel, and the heat of the at least one first electronic component is adapted to be conducted to the heat sink via the second leak-proof layer.
12. The circuit board module of claim 11, wherein the first leak-proof layer is composed of another thermally conductive gel, the conductivity of the other thermally conductive gel of the first leak-proof layer being less than the conductivity of the thermally conductive gel of the second leak-proof layer.