Semiconductor structures, semiconductor packages, and methods for forming semiconductor structures

Abstract

This disclosure provides a semiconductor structure, a semiconductor package, and a method for forming the semiconductor structure. The semiconductor structure provided in this disclosure includes a first surface having a first conductive pad and a first insulating layer, wherein the first insulating layer exposes at least a portion of the surface of the first conductive pad; a first interconnect layer disposed on the surface of the first conductive pad exposed on the first insulating layer and on the first insulating layer; and a first conductive bump disposed on the first interconnect layer and corresponding to the first conductive pad. In a cross-section perpendicular to the first surface, the absolute value of the difference between the width of the first conductive pad and the width of the first interconnect layer is greater than the absolute value of the width of the first conductive pad and the width of the first conductive bump. The semiconductor structure provided in this disclosure has a relatively large gap between the first interconnect layer and the first conductive bump, facilitating subsequent filling and sealing.

Images