Semiconductor device and manufacturing method thereof

TW202641072APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114118634
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-21
Filing Date
2025-05-19
Publication Date
2026-10-01

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Abstract

Methods and structures for forming a source / drain feature having a V-shaped profile to effectively reduce source / drain contact resistance. In some embodiments, a semiconductor device includes a plurality of stacked nanostructures disposed over a substrate, a source / drain feature adjacent to the plurality of stacked nanostructures, and a source / drain contact feature disposed over the source / drain feature. In some embodiments, the source / drain feature has a substantially V-shaped profile along a top surface of the source / drain feature.
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