Semiconductor device and manufacturing method thereof
TW202641072APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114118634
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-21
- Filing Date
- 2025-05-19
- Publication Date
- 2026-10-01
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Figure TWG2TA001078149_001 
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Abstract
Methods and structures for forming a source / drain feature having a V-shaped profile to effectively reduce source / drain contact resistance. In some embodiments, a semiconductor device includes a plurality of stacked nanostructures disposed over a substrate, a source / drain feature adjacent to the plurality of stacked nanostructures, and a source / drain contact feature disposed over the source / drain feature. In some embodiments, the source / drain feature has a substantially V-shaped profile along a top surface of the source / drain feature.
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