Integrated chip and method of forming the same

TW202641078APending Publication Date: 2026-10-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114116918
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-19
Filing Date
2025-05-06
Publication Date
2026-10-01

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    Figure TWG2TA001078115_003
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Abstract

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a gate structure over a substrate and a channel structure over the gate structure. A first source / drain contact and a second source / drain contact are disposed over the channel structure and the gate structure. The first source / drain contact is laterally separated from the second source / drain contact along a first direction. A capacitor is electrically coupled to the first source / drain contact. The first source / drain contact has a first length and the second source / drain contact has a second length measured along a second direction that is substantially perpendicular to the first direction. The first length is different than the second length.
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