Capacitor on integrated circuit package substrate
TW202641089APending Publication Date: 2026-10-01ARM LTD
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Patent Information
- Application Number
- TW114143747
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-22
- Filing Date
- 2025-11-10
- Publication Date
- 2026-10-01
Smart Images
Figure TWG2TA001078467_001 
Figure TWG2TA001078467_002 
Figure TWG2TA001078467_003
Abstract
An integrated circuit assembly comprises an integrated circuit die and a substrate electrically and physically coupled to the integrated circuit die. A capacitor is physically coupled to the substrate at a location physically between the integrated circuit die and the substrate, the capacitor electrically coupled to the integrated circuit die via at least one electrical connection.
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