Manufacturing method, cleaning solution and cleaning method of LED mounting substrate

Abstract

This invention discloses a method for manufacturing an LED mounting substrate, comprising the step of cleaning an LED chip transferred from a sapphire substrate to a receiver substrate by laser stripping using an alkaline cleaning solution. Accordingly, this invention provides a method for manufacturing an LED mounting substrate capable of selectively removing Ga metal attached to an LED chip transferred from a sapphire substrate to a receiver substrate by laser stripping without dissolving or modifying other metals; a cleaning solution applicable thereto; a cleaning method for selectively removing gallium attached to an LED chip without dissolving or modifying other metals; and a cleaning method for selectively removing gallium from parts having gallium and metals other than gallium on their surface without dissolving or modifying the metals other than gallium.

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