Light-emitting device

Abstract

The present disclosure provides a light-emitting device, including a substrate, a frame, a light-emitting element, a control element, an electrical testing part and a plurality of conductive elements. The substrate includes a first surface and a second surface opposite to each other. The frame is disposed on the first surface of the substrate, and has a first accommodation space and a second accommodation space separated therefrom. The light-emitting element is disposed in the first accommodating space. The control element is disposed in the second accommodating space. The electrical testing part is disposed in the substrate and being exposed by the first surface and the second surface. The electrical testing part is disposed between the light-emitting element and the control element and is electrically connected to the light-emitting element and the control element. The plurality of conductive elements are disposed on the side surface of the substrate and electrically connected to the control element.

Description

Technical Field

[0001] This disclosure relates to light-emitting devices, and in particular to light-emitting devices with improved luminous efficiency. Prior Technology

[0002] Light-emitting diodes (LEDs) are widely used in lighting devices across various fields due to their high efficiency, energy saving, and long lifespan. To meet different applications, lighting devices can use multiple LEDs emitting different colors, coupled with integrated circuit (IC) control components to drive the LEDs. Typically, the LEDs and IC control components are co-packaged within the same lighting device and share a common heat sink.

[0003] However, the IC control element absorbs some of the light emitted by the LED, which can easily cause asymmetry in the light pattern or a reduction in the overall light output efficiency. Furthermore, the LED is affected by current modulation, and the input power is variable, sometimes high and sometimes low, resulting in fluctuating heat generation. However, the IC control element requires a stable thermal environment during operation. If the LED light-emitting element and the IC are fixed on the same heat sink, the IC control element may be damaged or experience operational interference due to the unstable ambient temperature.

[0004] Therefore, how to further improve the component configuration of light-emitting devices to enhance their performance remains one of the topics that the industry is currently focusing on researching. Summary of the Invention

[0005] According to some embodiments disclosed herein, a light-emitting device is provided, comprising a substrate, a frame, a light-emitting element, a control element, an electrical testing section, and a plurality of conductive elements. The substrate includes opposing first and second surfaces. The frame is disposed on the first surface of the substrate, and the frame has a separated first accommodating space and a second accommodating space. The light-emitting element is disposed in the first accommodating space. The control element is disposed in the second accommodating space. The electrical testing section is disposed in the substrate and exposed via the first and second surfaces. The electrical testing section is disposed between the light-emitting element and the control element and is electrically connected to both the light-emitting element and the control element. The plurality of conductive elements are disposed on the side surfaces of the substrate and are electrically connected to the control element.

[0006] To make the features or advantages of this disclosure more apparent and understandable, some embodiments are described below in detail with reference to the accompanying drawings. Simple Explanation of the Diagram

[0007] Figure 1 shows a top view schematic diagram of the light-emitting device according to some embodiments of the present disclosure; Figure 2 shows a three-dimensional structural schematic diagram of the light-emitting device according to some embodiments of the present disclosure; Figure 3 shows a schematic cross-sectional view of the light-emitting device corresponding to the cutoff line A-A' in Figure 1, according to some embodiments of the present disclosure; Figure 4 shows a bottom view of the structure of the light-emitting device according to some embodiments of the present disclosure; Figure 5 shows a three-dimensional structural schematic diagram of the light-emitting device according to some embodiments of the present disclosure. Implementation

[0008] The following provides a detailed description of the light-emitting device according to embodiments of this disclosure. It should be understood that the following description provides many different embodiments for implementing various forms of some embodiments of this disclosure. The specific elements and arrangements described below are merely for simple and clear description of some embodiments of this disclosure. Of course, these are only examples and not limitations of this disclosure. Furthermore, similar and / or corresponding reference numerals may be used in different embodiments to identify similar and / or corresponding elements for clear description of this disclosure. However, the use of these similar and / or corresponding reference numerals is only for simple and clear description of some embodiments of this disclosure and does not represent any relationship between the different embodiments and / or structures discussed.

[0009] It should be understood that relative terms, such as "lower," "bottom," "higher," or "top," may be used in the embodiments to describe the relative relationship of one element to another in the diagram. It is understood that if the arrangement in the diagram is flipped upside down, an element depicted on the "lower" side will become an element on the "higher" side. This disclosure should be understood in conjunction with the drawings, which are considered part of the disclosure. It should be understood that the drawings in this disclosure are not drawn to scale; in fact, the dimensions of the elements may be arbitrarily enlarged or reduced to clearly show the features of this disclosure.

[0010] Furthermore, when it is mentioned that a first material layer is located on or above a second material layer, it may include situations where the first material layer and the second material layer are in direct contact, or situations where the first material layer and the second material layer are not in direct contact, that is, situations where there may be one or more other material layers between the first material layer and the second material layer. However, if the first material layer is located directly on the second material layer, it indicates that the first material layer and the second material layer are in direct contact.

[0011] Furthermore, it should be understood that the ordinal numbers "first," "second," and similar terms mentioned in the specification or claims of this case are used to name different elements or distinguish different embodiments or scopes, and are not used to limit the upper or lower limit of the number of elements, nor to limit the manufacturing order or the order of installation of the elements.

[0012] In some embodiments disclosed herein, terms such as "setup," "connection," and similar terms, unless specifically defined, may refer to two components in direct contact, or they may refer to two components not in direct contact, with an additional connecting component located between the two structures. Terms such as "setup" and "connection" may also include cases where both structures are movable or both structures are fixed.

[0013] In this document, the terms "about," "approximately," and "substantially" generally mean within 10%, 5%, 3%, 2%, 1%, or 0.5% of a given value or range. The terms "range greater than or equal to the first value and less than or equal to the second value" or "range between the first and second values" indicate that the range includes the first value, the second value, and other values ​​in between.

[0014] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It is understood that these terms, for example, as defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined in the embodiments of this disclosure.

[0015] According to some embodiments disclosed herein, the provided light-emitting device includes light-emitting elements and control elements respectively disposed in different accommodating spaces, and has an electrical testing section disposed in a specific manner, which can reduce mutual interference between the light-emitting elements and the control elements, thereby reducing the problem of light pattern asymmetry of the light-emitting elements, thereby improving the stability, luminous efficiency and overall performance of the light-emitting device.

[0016] According to some embodiments of this disclosure, the light-emitting devices described below can be applied to backlight modules (e.g., backlight modules for displays or backlight modules for automotive dashboards), lighting modules (e.g., automotive lighting modules, such as headlights, reversing lights, daytime running lights, taillights, turn signals, reading lights, and ambient lights, etc.) or other suitable optical devices, but this disclosure is not limited thereto.

[0017] Please refer to Figures 1 through 3. Figure 1 shows a top view of the light-emitting device 10 according to some embodiments of this disclosure. Figure 2 shows a perspective view of the light-emitting device 10 according to some embodiments of this disclosure. Figure 3 shows a cross-sectional view of the light-emitting device 10 corresponding to the cross-section A-A' in Figure 1 according to some embodiments of this disclosure. It should be understood that, for clarity, some elements of the light-emitting device may be omitted in the figures, and only some elements are schematically shown. According to some embodiments, additional features may be added to the light-emitting device described below. According to some embodiments, some features of the light-emitting device described below may be replaced or omitted.

[0018] The light-emitting device 10 includes a substrate SB, a frame 100, a light-emitting element 200, a control element 210, a first heat dissipation electrode 200P, a second heat dissipation electrode 210P, an electrical testing unit 310, and a plurality of conductive elements 300.

[0019] The substrate SB includes opposing first surfaces F1 and second surfaces F2, and also includes opposing first side surfaces S1 and S2, which are connected to the first surfaces F1 and F2. The substrate SB also includes opposing third side surfaces S3 and S4, which are also connected to the first surfaces F1 and F2. The substrate SB can serve as a support for the light-emitting device 10, supporting other components.

[0020] According to some embodiments, the first heat dissipation electrode 200P, the second heat dissipation electrode 210P, and the electrical testing section 310 are located in the substrate SB, and the substrate SB includes an insulating structure IL (as shown in Figure 3). The insulating structure IL extends through the substrate SB; in other words, it extends from the first surface F1 to the second surface F2. The insulating structure IL can be disposed between the first heat dissipation electrode 200P, the second heat dissipation electrode 210P, and the electrical testing section 310, so that these components are electrically insulated from each other. The detailed structure of the first heat dissipation electrode 200P and the second heat dissipation electrode 210P will be described below. Furthermore, the insulating structure IL has a top width Wa and a bottom width Wb, and the top width Wa is different from the bottom width Wb. For example, the top width Wa may be smaller than the bottom width Wb, but it is not limited thereto.

[0021] Furthermore, the frame 100 is disposed on the first surface F1 of the substrate SB, and the frame 100 may have a separated first accommodating space C1 and a second accommodating space C2. According to some embodiments, the size of the second accommodating space C2 is larger than the size of the first accommodating space C1. The second accommodating space C2 can accommodate a relatively large component (e.g., control element 210), while the first accommodating space C1 can accommodate a relatively small component (e.g., light-emitting element 200), but is not limited thereto. According to some embodiments, the frame 100 may have a partition wall 100w for separating the first accommodating space C1 and the second accommodating space C2, and the partition wall 100w partially overlaps with the electrical testing section 310 in a direction perpendicular to the substrate SB (e.g., the Z direction in the figure). In other words, the partition wall 100w can divide the space in the frame 100 into the first accommodating space C1 and the second accommodating space C2. Furthermore, the frame 100 may partially cover the substrate SB. In detail, according to some embodiments, the frame 100 may include an outer frame portion 100o formed around the periphery of the substrate SB and an isolation wall 100w located within the outer frame portion 100o, wherein the outer frame portion 100o and the isolation wall 100w may be a continuous structure. According to some embodiments, the control element 210 may be an IC chip used to drive the brightness and color coordinates of the light-emitting element 200.

[0022] According to some embodiments, the materials of the frame 100 and the insulating structure IL may include resins such as thermosetting resins or thermoplastic resins. Thermosetting resins may include, for example, epoxy resin, silicone resin, or polyester resin. Thermoplastic resins may include, for example, polyphthalamide (PPA), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), other suitable materials, or combinations thereof, but are not limited thereto. Furthermore, the frame 100 and the insulating structure IL may further include reflective particles for reflecting light to improve the light emission efficiency of the light-emitting device. According to some embodiments, the reflective particles are mixed with the aforementioned thermosetting or thermoplastic resins to make the frame 100 and the insulating structure IL appear opaque; for example, doping with white reflective particles can make the frame 100 and the insulating structure IL appear white. According to some embodiments, the reflective particles may be, for example, titanium oxide, silicon oxide, zirconium oxide, aluminum oxide, or aluminum nitride. According to some implementations, the frame 100 and the insulating structure IL can be integrally formed, that is, both have the same material.

[0023] The light-emitting element 200 can be disposed in the first accommodating space C1 and on the first heat dissipation electrode 200P of the substrate SB, and is electrically connected to the first heat dissipation electrode 200P. Specifically, the light-emitting device 10 may include a plurality of light-emitting elements 200, and each light-emitting element 200 may include a light-emitting diode chip, such as a horizontal LED chip, a vertical LED chip, or a flip-chip LED chip. For ease of explanation, they are labeled as light-emitting element 200a, light-emitting element 200b, and light-emitting element 200c in the figures to distinguish different light-emitting elements. Light-emitting elements 200a, 200b, and 200c may contain different or the same color combinations. According to some embodiments, the light-emitting element 200 may emit blue light, red light, green light, yellow light, or other suitable colors of light, but this disclosure is not limited thereto. For example, according to some embodiments, as shown in Figure 1, light-emitting elements 200a, 200b, and 200c may emit green light, red light, and blue light, respectively. In some embodiments, light-emitting elements 200a, 200b, and 200c may be green LED chips, red LED chips, and blue LED chips, respectively. However, this disclosure is not limited to these embodiments, and the number of light-emitting elements 200 and the combination of LED chips with different or the same color can be adjusted according to application requirements. In some embodiments, the green-emitting element 200a may be a chip-scale packaged (CSP) LED, which contains a blue LED chip and a green phosphor film or a green quantum dot film, and the green phosphor film or green quantum dot film covers the top surface and / or four sides of the blue LED chip. In some embodiments, the red-emitting element 200b may be a chip-scale packaged (CSP) LED, which contains a blue LED chip and a red phosphor film or a red quantum dot film, and the red phosphor film or red quantum dot film covers the top surface and / or four sides of the blue LED chip. According to some embodiments, the light-emitting element 200 (LED chip) can be electrically connected to the electrical testing section 310 via a wire CL, and then electrically connected to the control element 210 via the wire CL.

[0024] It should be understood that the number of light-emitting elements 200 is merely illustrative and not limited to that shown in the diagram. Depending on the embodiment, the light-emitting device 10 may have other suitable numbers of light-emitting elements 200. For example, in addition to the aforementioned green LED chip, red LED chip, and blue LED chip, the light-emitting device 10 may further include a white LED (not shown) located in the first accommodating space C1. According to some embodiments, the white LED may be a CSP LED containing a blue LED chip and a yellow phosphor film covering the light-emitting surface of the blue LED chip.

[0025] Furthermore, according to some embodiments, the light-emitting device 10 may further include a first encapsulant 202 disposed in the first accommodating space C1. The first encapsulant 202 is located on the first surface F1 of the substrate SB of the first accommodating space C1 to cover the upper surface and side surface of the light-emitting element 200 (200b). The first encapsulant 202 is light-transmitting, allowing light to penetrate to the outside of the light-emitting device 10, and the first encapsulant 202 can protect the light-emitting element 200 and reduce the impact of ambient moisture on the light-emitting element 200. According to some embodiments, the surface of the first encapsulant 202 is translucent or hazy. In some embodiments, the material of the first encapsulant 202 includes silicone resin, epoxy resin, phenolic resin, polycarbonate resin, acrylic resin, or modified resin thereof.

[0026] According to some embodiments, the light-emitting device 10 may further include optical particles 202r dispersed in the first encapsulant 202, wherein the optical particles 202r may be light-diffusing particles, wavelength-converting particles, or a combination thereof. Specifically, the light-diffusing particles are used to diffuse the light emitted by the light-emitting element 200, and the light-diffusing particles may be organic or inorganic particles. Materials used as organic particles may include, for example, silicone resins, acrylic resins, etc., while materials used as inorganic particles may include, for example, silicon dioxide, boron nitride, etc. Wavelength-converting particles can convert the light emitted by the light-emitting diode into light with a specific color or a specific wavelength. Wavelength-converting particles may include phosphors, quantum dot materials, or combinations thereof, but are not limited to these. Taking the white light emitted by the light-emitting device as an example, the light-emitting elements 200a, 200b, and 200c can be blue light-emitting diode chips, and the wavelength conversion particles can include yellow phosphors. For example, the yellow phosphor can be yttrium aluminum garnet (YAG) phosphor, so the light-emitting device 10 can emit white light, but this disclosure is not limited thereto. According to some embodiments, the wavelength conversion particles can include red phosphors, green phosphors, other suitable colored phosphors, or combinations thereof, but are not limited thereto. According to some embodiments, the wavelength conversion particles can include two different red phosphors, green phosphors, other suitable colored phosphors, or combinations thereof, but are not limited thereto. According to some embodiments, the wavelength conversion particles can include green phosphors and red phosphors. For example, the wavelength conversion particles can include green phosphor β-SiAlON:Eu 2+ and red phosphor K 2SiF 6:Mn 4+. According to some embodiments, the wavelength conversion particle may comprise a combination of green phosphor and two red phosphors. For example, the wavelength conversion particle may comprise green phosphor β-SiAlON:Eu 2+, red phosphor K 2SiF 6:Mn 4+ and (Sr,Ca)AlSiN 3:Eu 2+.

[0027] The control element 210 can be disposed in the second accommodating space C2 and on the second heat dissipation electrode 210P of the substrate SB, and electrically connected to the second heat dissipation electrode 210P. The control element 210 can have a horizontal wafer, vertical wafer, or flip-chip structure. According to some embodiments, the control element 210 can be electrically connected to the electrical testing section 310 via a wire CL, and then further electrically connected to the light-emitting element 200 via a wire CL. In addition, according to some embodiments, the control element 210 can have contacts such as a power supply terminal (VDD), a ground terminal (GND), a data input terminal (DAI), a data output terminal (DAO), a clock input terminal (CKI), and a clock output terminal (CKO), but is not limited thereto. These contacts of the control element 210 can be further electrically connected to the conductive element 300 via a wire CL. The control element 210 can control the operation of the light-emitting elements 200, enabling the light-emitting elements 200 (e.g., light-emitting elements 200a, 200b, and 200c) to be lit or turned off independently, thereby allowing the light-emitting elements 200a, 200b, and 200c to produce different color and / or brightness combinations. The control element 210 can also enable the light-emitting elements 200a, 200b, and 200c to be lit simultaneously.

[0028] According to some embodiments, the control element 210 may include an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a complex programmable logic device (CPLD), or other suitable control elements. An ASIC is an integrated circuit designed and manufactured to meet the specific requirements of a particular user and a particular electronic system. An FPGA is a further development based on programmable devices such as programmable array logic (PAL), gate array logic (GAL), and programmable logic device (PLD). A CPLD is a device developed from PAL and GAL, and is relatively large in scale and complex in structure, belonging to the category of large-scale integrated circuits.

[0029] Furthermore, according to some embodiments, the light-emitting device 10 may further include a second encapsulating adhesive 212 disposed in the second accommodating space C2. In some embodiments, the material of the second encapsulating adhesive 212 includes silicone resin, epoxy resin, phenolic resin, polycarbonate resin, acrylic resin, or modified resin thereof. The second encapsulating adhesive 212 may cover the upper surface and side surface of the control element 210, and the second encapsulating adhesive 212 may protect the control element 210 and reduce the impact of ambient moisture on the control element 210. According to some embodiments, the reflectivity of the first encapsulating adhesive 202 and the second encapsulating adhesive 212 are different; for example, the reflectivity of the first encapsulating adhesive 202 may be lower than that of the second encapsulating adhesive 212. According to some embodiments, the light-emitting device 10 may further include reflective particles 212r dispersed in the second encapsulating adhesive 212, and the reflective particles 212r may have a high reflectivity. In addition, the second encapsulating adhesive 212 is doped with a high concentration of reflective particles 212r, making the surface of the second encapsulating adhesive opaque, so that the control element 210 is not visible from the appearance of the light-emitting device 10.

[0030] According to some embodiments, the material of the reflective particle 212r may include titanium dioxide (TiO 2), niobium-doped titanium oxide (TNO), zinc oxide (ZnO), zirconium dioxide (ZrO 2), silicon dioxide (SiO 2), other suitable reflective materials, or combinations thereof, but is not limited thereto.

[0031] It is worth noting that, since the light-emitting element 200 and the control element 210 are disposed in different accommodating spaces, when the light-emitting element 200 emits light, the light can be blocked by the substrate SB (e.g., the insulating wall 100W), reducing the light absorption by the control element 210 and helping to improve the overall luminous efficiency of the light-emitting device. This configuration reduces mutual interference between the light-emitting element 200 and the control element 210, thereby reducing the problem of light pattern asymmetry in the light-emitting element 200, and thus improving the stability, luminous efficiency, and overall performance of the light-emitting device 10.

[0032] Furthermore, the thickness of the control element 210 is usually greater than that of the light-emitting element 200. Therefore, when adhesive is required to be applied to the bottom of the substrate SB, the light-emitting element 200, which is located in the same accommodating space, is easily covered by excess adhesive. By using the aforementioned arrangement of the light-emitting element 200 and the control element 210 in different accommodating spaces, the risk of excess adhesive affecting the performance of the light-emitting element 200 can be reduced.

[0033] Please refer to Figures 1, 4, and 5 simultaneously. Figure 4 shows a bottom view of the light-emitting device 10 according to some embodiments of this disclosure, and Figure 5 shows a perspective view of the light-emitting device 10 according to some embodiments of this disclosure. Three electrical test sections 310 can be disposed in the substrate SB and exposed via the first surface F1 and the second surface F2; that is, the electrical test sections 310 can penetrate the substrate SB and be exposed on the first surface F1 and the second surface F2. Furthermore, the electrical test sections 310 can be disposed between the light-emitting element 200 and the control element 210 and are electrically connected to both the light-emitting element 200 and the control element 210. The electrical test sections 310 can serve as components for testing the electrical characteristics (e.g., whether leakage current is generated) of the light-emitting element 200 and the control element 210. For example, if the light-emitting element 200 and the control element 210 are found to be abnormal before leaving the factory, they can be replaced. The electrical test sections 310 can also serve as relay shared conductive ports. Furthermore, the electrical testing section 310 also functions as a supporting structure. The electrical testing section 310 can have different shapes. For example, when viewed from above, the second surface F2 of the substrate SB can have a rectangular shape, a bent shape, or an arc-shaped edge profile, but it is not limited to these. According to some embodiments, the electrical testing section 310 with a bent shape can be disposed adjacent to the first side surface S1 of the substrate SB, but it is not limited to these.

[0034] The electrical testing section 310 may be formed of a conductive material. According to some embodiments, the material of the electrical testing section 310 may include copper (Cu), silver (Ag), gold (Au), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), alloys of the aforementioned metals, other suitable materials, or combinations thereof, but is not limited thereto.

[0035] Furthermore, according to some embodiments, the light-emitting device 10 may further include a first heat-dissipating electrode 200P and a second heat-dissipating electrode 210P disposed in the substrate SB. The first heat-dissipating electrode 200P and the second heat-dissipating electrode 210P may be separate. The first heat-dissipating electrode 200P and the second heat-dissipating electrode 210P are disposed in the substrate SB and exposed through the first surface F1 and the second surface F2. That is, the first heat-dissipating electrode 200P and the second heat-dissipating electrode 210P may penetrate the substrate SB and be exposed at the first surface F1 and the second surface F2. The first heat-dissipating electrode 200P and the second heat-dissipating electrode 210P may correspond to the first accommodating space C1 and the second accommodating space C2, respectively. The light-emitting element 200 may be disposed on the first heat-dissipating electrode 200P, and the control element 210 may be disposed on the second heat-dissipating electrode 210P. That is, the light-emitting element 200 and the control element 210 are on their respective heat-dissipating electrodes, which can prevent thermal interference. In detail, in the normal direction of the substrate SB (e.g., the Z direction in the figure), the light-emitting element 200 may overlap with the position of the first heat-dissipating electrode 200P, and the control element 210 may overlap with the position of the second heat-dissipating electrode 210P.

[0036] As described above, the insulating structure IL is disposed between the first heat dissipation electrode 200P, the second heat dissipation electrode 210P, and the electrical testing section 310. According to some embodiments, a portion of the electrical testing section 310 may be disposed on the horizontal line connecting the first heat dissipation electrode 200P and the second heat dissipation electrode 210P, while a portion may not be disposed on the horizontal line connecting the first heat dissipation electrode 200P and the second heat dissipation electrode 210P. According to some embodiments, the first heat dissipation electrode 200P and the second heat dissipation electrode 210P have different dimensions. According to some embodiments, the first heat dissipation electrode 200P is larger than the second heat dissipation electrode 210P. According to other embodiments, the first heat dissipation electrode 200P is smaller than the second heat dissipation electrode 210P. According to some embodiments, the first heat dissipation electrode 200P may have at least one recessed profile, such as two recessed profiles. According to some embodiments, the second heat dissipation electrode 210P may have a chamfered shape.

[0037] The first heat dissipation electrode 200P and the second heat dissipation electrode 210P may be formed of a conductive metal material. According to some embodiments, the materials of the first heat dissipation electrode 200P and the second heat dissipation electrode 210P may include copper (Cu), silver (Ag), gold (Au), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), alloys of the aforementioned metals, other suitable materials, or combinations thereof, but are not limited thereto.

[0038] It is worth noting that the light-emitting element 200 is usually subject to current modulation, and the input power is uncertain and the heat generated also changes frequently. By configuring the first heat dissipation electrode 200P and the second heat dissipation electrode 210P respectively to the light-emitting element 200 and the control element 210, the unstable thermal energy of the operating environment of the control element 210 can be reduced, thereby improving the stability and performance of the control element 210.

[0039] Referring to Figures 1, 4, and 5, a plurality of conductive elements 300 may be disposed in the substrate SB and electrically connected to the control element 210. Specifically, conductive elements 300 may be disposed on the first side S1 and the second side S2 of the substrate SB, and the number of conductive elements 300 disposed on the first side S1 (labeled as conductive elements 300a and 300b for ease of explanation) is different from the number of conductive elements 300 disposed on the second side S2 (labeled as conductive elements 300c, 300d, 300e, and 300f for ease of explanation). For example, the number of conductive elements 300 disposed on the first side S1 is less than the number of conductive elements 300 disposed on the second side S2. According to some embodiments, conductive elements 300 may partially protrude from the first side S1 and the second side S2 of the substrate SB. According to some embodiments, conductive elements 300 have an end 300N, and the cross-sectional area of ​​the end 300N tapers away from the substrate SB. According to some embodiments, the end portion 300N of the conductive element 300 may have a tapered profile.

[0040] Furthermore, according to some embodiments, the conductive element 300 includes a data output terminal (DAO) and a clock output terminal (CKO) located on the first side S1, and a power input terminal (VDD), a data input terminal (DAI), a clock input terminal (CKI), and a ground terminal (GND) located on the second side S2. According to some embodiments, conductive element 300a may be a data output terminal (DAO), conductive element 300b may be a clock output terminal (CKO), conductive element 300c may be a power input terminal (VDD), conductive element 300d may be a data input terminal (DAI), conductive element 300e may be a clock input terminal (CKI), and conductive element 300f may be a ground terminal (GND). As mentioned above, the control element 210 may have contacts corresponding to conductive elements 300a, 300b, 300c, 300d, 300e and 300f, and may be electrically connected to conductive elements 300a, 300b, 300c, 300d, 300e and 300f respectively via wires CL.

[0041] Furthermore, the conductive element 300 may be formed of a conductive metallic material. According to some embodiments, the material of the conductive element 300 may include copper (Cu), silver (Ag), gold (Au), tin (Sn), aluminum (Al), molybdenum (Mo), tungsten (W), chromium (Cr), nickel (Ni), platinum (Pt), titanium (Ti), alloys of the aforementioned metals, other suitable materials, or combinations thereof, but is not limited thereto.

[0042] In summary, according to the embodiments disclosed herein, the light-emitting device includes different accommodating spaces to house the light-emitting element and the control element, and the light-emitting element and the control element are located on different heat dissipation electrodes. This reduces mutual interference between their light and heat, thereby reducing the problem of light pattern asymmetry in the light-emitting element, and thus improving the stability, luminous efficiency, and overall performance of the light-emitting device. Furthermore, the light-emitting device has an electrical testing section to test whether the light-emitting element and the control element are abnormal, thereby improving the yield of the light-emitting device.

[0043] While the embodiments and advantages of this disclosure have been disclosed above, it should be understood that anyone skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of this disclosure. Features between the embodiments disclosed herein can be freely combined and used as long as they do not violate the spirit of the invention or conflict with it. Furthermore, the scope of protection of this disclosure is not limited to the processes, machines, manufacturing, material composition, apparatus, methods, and steps described in the specific embodiments of the specification. Anyone skilled in the art can understand from the content of this disclosure the current or future development of processes, machines, manufacturing, material composition, apparatus, methods, and steps, and can use them according to this disclosure as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of this disclosure includes the aforementioned processes, machines, manufacturing, material composition, apparatus, methods, and steps. The scope of protection of this disclosure shall be determined by the appended claims. No embodiment or claim of this disclosure needs to achieve all the purposes, advantages, and features disclosed herein.

[0044] 10: Light-emitting device 100: Frame 100o: Outer frame 100w: Isolation Wall 200: Light-emitting element 200a: Light-emitting element 200b: Light-emitting element 200c: Light-emitting element 200P: First heat dissipation electrode 202: First encapsulating adhesive 202r: Optical Particles 210: Control element 210P: Second heat dissipation electrode 212: Second encapsulating adhesive 212r: Reflecting particle 300: Conductive component 300a: Conductive component 300b: Conductive component 300c: Conductive component 300d: Conductive component 300e: Conductive component 300f: Conductive component 300N: End 310: Electrical Testing Department A-A': Cutoff line C1: First accommodating space C2: Second accommodating space CL: Wire F1: First surface F2: Second surface IL: Insulation Structure S1: First side view S2: Second side S3: Third Side S4: Fourth Side SB: Base Wa: Top width Wb: Bottom width

Claims

1. A light-emitting device, comprising: A substrate, comprising a first surface and a second surface opposite to each other; A frame is disposed on the first surface of the substrate, and the frame has a first accommodating space and a second accommodating space separated by a partition; a light-emitting element is disposed in the first accommodating space; a control element is disposed in the second accommodating space; an electrical testing unit is disposed in the substrate and exposed through the first surface and the second surface, the electrical testing unit is disposed between the light-emitting element and the control element and is electrically connected to the light-emitting element and the control element; And a plurality of conductive elements disposed on the side of the substrate and electrically connected to the control element.

2. The light-emitting device as claimed in claim 1, wherein the substrate includes a first side surface and a second side surface opposite to each other, the first side surface and the second side surface being connected to the first surface and the second surface, the conductive elements being disposed on the first side surface and the second side surface, and the number of conductive elements disposed on the first side surface being different from the number of conductive elements disposed on the second side surface.

3. The light-emitting device as claimed in claim 2, wherein the conductive elements include a data output terminal (DAO) and a clock output terminal (CKO) located on the first side, and a power input terminal (VDD), a data input terminal (DAI), a clock input terminal (CKI), and a ground terminal (GND) located on the second side.

4. The light-emitting device as claimed in claim 2, wherein the conductive elements partially protrude from the first side and the second side of the substrate.

5. The light-emitting device as claimed in claim 4, wherein the conductive elements have ends whose cross-sectional area tapers away from the substrate.

6. The light-emitting device as claimed in claim 1, wherein the frame has a partition wall for separating the first accommodating space and the second accommodating space, the partition wall partially overlapping the electrical testing section in a direction perpendicular to the substrate.

7. The light-emitting device as claimed in claim 1 further includes a first heat-dissipating electrode and a second heat-dissipating electrode disposed in the substrate and exposed via the first surface and the second surface, the first heat-dissipating electrode and the second heat-dissipating electrode respectively corresponding to the first accommodating space and the second accommodating space, the light-emitting element disposed on the first heat-dissipating electrode, and the control element disposed on the second heat-dissipating electrode.

8. The light-emitting device as claimed in claim 1 further includes a first encapsulant and a second encapsulant, wherein the first encapsulant is disposed in the first receiving space, the second encapsulant is disposed in the second receiving space, and the first encapsulant and the second encapsulant have different reflectivities.

9. The light-emitting device as claimed in claim 8, wherein the surface of the first encapsulant is translucent or hazy, and the surface of the second encapsulant is opaque.

10. The light-emitting device as claimed in claim 7, wherein the substrate has an insulating structure disposed between the first heat-dissipating electrode, the second heat-dissipating electrode and the electrical testing section, and the insulating structure has a top width and a bottom width, the top width being different from the bottom width.

Images