Reflector structures for recesses in light-emitting diode packages

Abstract

Light-emitting diode （LED） devices and more particularly reflector structures for recesses in LED packages are disclosed. Exemplary LED packages include lead frame structures with housings and one or more housing recesses for one or more LED chips. Reflector structures include reflector coatings or reflector inserts positioned within the recesses. For increased reflectivity relative to LED chip emissions, reflector structures may include metallic reflectors. Corresponding insulating layers are provided at bases of recesses to provide electrical insulation between reflector structures and underlying lead frame structures. Arrangements of insulating layers are disclosed that partially extend into recesses and sometimes at least partially into housings in directions away from recesses.

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