Process for preparing a thin layer made of piezoelectric material by ion etching
TW202641162APending Publication Date: 2026-10-01SOITEC SA
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Patent Information
- Application Number
- TW114143862
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-12
- Filing Date
- 2025-11-11
- Publication Date
- 2026-10-01
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Abstract
The present invention relates to a method for preparing a single-domain thin layer (4) of a piezoelectric material, the method comprising finishing a first layer (8) transferred onto a support (2). The finishing process includes heat-treating the free surface (9) of the first layer, followed by thinning to form the single-domain thin layer (4). According to the invention, the thinning of the first layer (8) comprises reactive ion etching using a plasma prepared from a mixture of a rare gas and a chlorine gas. The invention relates to a process for preparing a single-domain thin layer (4) made of piezoelectric material, comprising the finishing of a first layer (8) transferred onto a support (2). The finishing comprises heat treatment of the free face (9) of the first layer, followed by its thinning to form the single-domain thin layer (4).
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