Substrate bonding apparatus and substrate bonding method

Abstract

A substrate bonding apparatus is disclosed for bonding two substrates W, each having a bonding surface. The substrate bonding apparatus includes: a wet processing unit that supplies a chemical solution to the bonding surfaces of the substrates, thereby hydrophilicating the bonding surfaces by imparting hydrophilic groups (e.g., hydroxyl groups) to the bonding surfaces; and a bonding unit that bonds the bonding surfaces of the two substrates, each having a bonding surface hydrophilicated by the wet processing unit, together. The substrate bonding apparatus does not perform a surface-activating treatment as a pretreatment for hydrophilicating the bonding surfaces. The chemical solution is preferably an alkaline solution. Furthermore, the chemical solution is preferably an organic base solution.

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