Wire bonding device and method for bonding wires

Abstract

The objective of this invention is to achieve a desired shape for the joined wire in wire bonding during deformation of the bonding object. The wire bonding apparatus 1 includes: a capillary tube 2 extending along a predetermined axis A2 for bonding a wire 8 to an overhang 93 (the bonding object); a bonding tool 3 holding the capillary tube 2 and movable along the Z-axis direction of the predetermined axis A2 and along a drive plane DP intersecting the Z-axis direction; and a controller 6 controlling the movement of the capillary tube 2 based on the bonding tool 3. The controller 6, by assigning a control signal C6 to the bonding tool 3, simultaneously performs a bonding action that moves the capillary tube 2 along the Z-axis direction and an adjustment action that moves the capillary tube 2 along the drive plane DP while the capillary tube 2 is subjected to a reaction force from the overhang 93.

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