Method for forming high modulus and hardness carbon films with low pressure and low power pecvd
TW202641187APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114147723
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-05
- Filing Date
- 2025-12-05
- Publication Date
- 2026-10-01
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Figure TWG2TA001078691_001 
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Abstract
A method for processing a substrate is provided. The method includes flowing a precursor gas comprising a hydrocarbon compound into a process volume of a process chamber having a substrate positioned on a substrate support. The method also includes generating a plasma at the substrate by applying a RF bias to the substrate support, wherein the RF bias is provided at a power of about
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