Method of manufacturing semiconductor device and semiconductor device
TW202641190APending Publication Date: 2026-10-01RENESAS ELECTRONICS CORP
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Patent Information
- Application Number
- TW115101339
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-31
- Filing Date
- 2026-01-14
- Publication Date
- 2026-10-01
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Abstract
A method of manufacturing a semiconductor device includes forming a trench at an upper surface of a first semiconductor layer, introducing a first impurity of a first conductivity type into the first semiconductor layer in an element formation region, forming a first impurity region by diffusing the first impurity by heat treatment, forming a second semiconductor layer on the first semiconductor layer by epitaxial growth, introducing a second impurity of the first conductivity type into the second semiconductor layer, forming a second impurity region so as to be connected to the first impurity region by diffusing the second impurity by heat treatment, and forming a semiconductor element on the second semiconductor layer.
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