Laser ablation of backside dielectric to adjust substrate warpage
TW202641196APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114138767
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2025-10-08
- Publication Date
- 2026-10-01
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Figure TWG2TA001078338_001 
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Abstract
Embodiments described herein relate to a method that includes mapping a distortion of a substrate that includes a device layer over a front side surface of the substrate and a dielectric layer over a backside surface of the substrate. In an embodiment, the method further includes ablating a portion of the dielectric layer with a laser to form an opening in the dielectric layer, where the distortion of the substrate is reduced by forming the opening.
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