Plasma treatment apparatus and plasma treatment method

Abstract

This invention provides a plasma treatment apparatus and method that can improve the yield of plasma treatment even when performing various plasma treatments under different processing conditions using the same plasma treatment apparatus. The plasma treatment apparatus of one embodiment includes: a chamber capable of maintaining an atmosphere depressurized below atmospheric pressure; a loading section disposed inside the chamber and for loading the workpiece; a plurality of body sections detachably disposed inside the chamber facing the loading section, cylindrical in shape and having different dimensions along a central axis; a first dispersion plate disposed at the end of the body section on the loading section side, facing the loading section and having a plurality of holes; a depressurization section capable of depressurizing the interior of the body sections; a gas supply section capable of supplying process gas to the interior of the body sections; and a plasma generation section capable of generating plasma inside the body sections. During plasma treatment, depending on the processing conditions of the plasma treatment, one of the plurality of body sections is selected such that the distance between the loading section and the first dispersion plate is a desired value.

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