Etching method

TW202641206APending Publication Date: 2026-10-01SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
TW115104113
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-17
Filing Date
2026-02-03
Publication Date
2026-10-01

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    Figure TWG2TA001079276_003
Patent Text Reader

Abstract

The objective of this invention is to efficiently etch a substrate having an etchable film formed adjacent to an insulating film using an etching solution. In this invention, ultraviolet light is irradiated onto the etching solution. This generates OH radicals within the etching solution. The etching of the etchable film is then performed using an etching solution containing these OH radicals.
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