Method for chemical-mechanical polishing of a substrate semiconductor wafer

TW202641212APending Publication Date: 2026-10-01SILTRONIC AG +1
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Patent Information

Application Number
TW115106648
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-25
Filing Date
2026-02-24
Publication Date
2026-10-01

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Abstract

The invention relates to a method for chemical-mechanical polishing of at least one substrate semiconductor wafer by means of a polishing device comprising at least one polishing head, which comprises at least one pressure chamber and a retaining ring at the outer edge, wherein at least one substrate semiconductor wafer currently to be polished comprises a first wafer side and a second wafer side, wherein the method comprises at least one polishing sequence which comprises steps (I) to (III), wherein the steps (I) to (III) are as defined in the specification.
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