Workpiece processing methods and cutting devices

TW202641215APending Publication Date: 2026-10-01TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
TW115108733
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-17
Filing Date
2026-03-10
Publication Date
2026-10-01

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Abstract

[Problem] Stably setting the position for workpiece machining. [Solution] A workpiece machining method, characterized in that: a measuring line is set on the surface of the workpiece, the measuring line being used to obtain a height distribution representing the change in the height of the workpiece; the height distribution is obtained by measuring the height of the workpiece along the measuring line; a characteristic waveform repeatedly generated in the height distribution is specified; and a machining line for machining the workpiece is set based on the characteristic waveform. none
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