Laser heating to adjust substrate warpage
TW202641216APending Publication Date: 2026-10-01APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114137888
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-28
- Filing Date
- 2025-10-01
- Publication Date
- 2026-10-01
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Figure TWG2TA001078323_001 
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Abstract
Embodiments described herein relate to a method that includes forming a dielectric layer over a backside surface of a substrate, where the backside surface is opposite from a device layer on the substrate, and mapping a distortion of the substrate. In an embodiment, the method further includes irradiating a portion of the dielectric layer with a laser to locally modify the dielectric layer, where the dielectric layer has a first modulus and a modified portion of the dielectric layer has a second modulus that is different than the first modulus.
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