Wafer processing strip
TW202641221APending Publication Date: 2026-10-01DENKA CO LTD
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Patent Information
- Application Number
- TW114124300
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-07-01
- Filing Date
- 2025-06-27
- Publication Date
- 2026-10-01
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Figure 00000000_0000_ABST
Abstract
The object of this invention is to provide a wafer processing tape capable of suppressing wafer warpage, and a wafer processing method using the wafer processing tape. This invention relates to a wafer processing tape comprising a substrate layer, wherein, in a load change curve over time when the substrate layer is stretched by 10% relative to its original length in at least one direction within the surface of the substrate layer at 23°C and held thereon, the maximum shrinkage load is 10 N or less.
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