Methods for cleaning a plasma processing chamber and processing a plurality of process wafers in a plasma processing chamber

TW202641229APending Publication Date: 2026-10-01LAM RES CORP
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Patent Information

Application Number
TW115108020
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-06-15
Filing Date
2021-06-11
Publication Date
2026-10-01

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Abstract

A method for cleaning a plasma processing chamber comprising one or more cycles is provided. Each cycle comprises performing an oxygen containing plasma cleaning phase, performing a volatile chemistry type residue cleaning phase, and performing a fluorine containing plasma cleaning phase.
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