Substrate cleaning apparatus, substrate cleaning method and control program

TW202641232APending Publication Date: 2026-10-01SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115109337
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2026-01-30
Filing Date
2026-03-13
Publication Date
2026-10-01

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Abstract

This substrate cleaning apparatus improves the processing efficiency of substrate cleaning while suppressing substrate damage or backcontamination from the cleaning body. An embodiment of the substrate cleaning apparatus includes: a holding unit for holding the substrate; a supply unit for supplying cleaning liquid to the surface to be treated of the substrate; a cleaning unit for cleaning the surface to be treated by contacting the cleaning body; a measuring unit for measuring the amount of particles contained in the cleaning liquid discharged from the surface to be treated; and a control unit for controlling the contact load applied by the cleaning body to the surface to be treated based on the measured amount of particles.
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