Wafer processing equipment

Abstract

This disclosure provides a wafer processing apparatus belonging to the semiconductor manufacturing field, comprising: a wafer processing chamber; multiple process stations disposed within the wafer processing chamber, each process station including a spray head and a heating stage positioned below the spray head; and an exhaust port located at the bottom of the wafer processing chamber; wherein an air curtain element is provided between adjacent process stations, the air curtain element including an inlet and an exhaust section, the inlet for introducing air curtain gas into the wafer processing chamber, and the exhaust section for discharging the air curtain gas out of the wafer processing chamber, thereby forming a separating air curtain between the adjacent process stations.

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