High power lamp assembly for substrate processing

Abstract

Embodiments of the present disclosure include a thermal processing chamber comprising a radiant source assembly and a lamp assembly, which are adapted to perform one or more thermal processes that benefit from precise substrate process temperature control, improved substrate temperature uniformity, and rapid substrate temperature ramp rates during thermal processing. The embodiments of the disclosure provided herein include a radiant source assembly that includes a plurality of lamp assemblies that are positioned within a processing environment of a thermal processing chamber to heat a substrate positioned within the processing environment directly. The radiant source assembly and lamp assembly designs, as well as the materials used to form these assemblies, are configured to deliver high radiant energy fluxes and prevent significant outgassing during processing, thereby avoiding the common contamination issues associated with conventional lamps being positioned within the thermal processing chamber's processing environment.

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