Installation device, control method for installation device, and control program for installation device

Abstract

This invention provides a mounting apparatus capable of appropriately transferring a semiconductor wafer supported on a transfer device to a mounting tool, a control method for the mounting apparatus, and a control program for the mounting apparatus. The mounting apparatus includes: a mounting tool having an adsorption section that adsorbs the holding surface of a mounting object, and mounting the mounting surface of the mounting object adsorbed by the adsorption section onto a mounting object placed on a stage; a transfer device that receives the mounting object and positions the holding surface facing the mounting tool; a camera unit that captures images of a working area parallel to a reference plane and the holding surface; and a control unit that calculates the height information of the mounting object based on images obtained by the camera unit capturing images of the mounting object supported on the transfer device, and based on the height information, lowers the mounting tool toward the mounting object so that the adsorption section is positioned at a separation distance set relative to the mounting object in the height direction, and operates the adsorption section to adsorb the mounting object from the transfer device.

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